LM3421 datasheet(5/72 Pages) TI1

5 / 72 page

LM3421, LM3421-Q1, LM3423, LM3423-Q1

www.ti.com

SNVS574F – JULY 2008 – REVISED JULY 2015

6.2 ESD Ratings: LM3421, LM3423

VALUE

UNIT

LM3421, LM3423

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±500

LM3421-Q1, LM3423-Q1,

LM3421-Q0, LM3423-Q0

Human body model (HBM), per AEC Q100-002(3)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per AEC Q100-011

All Pins

±750

Pin 4

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(3)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

LM3421, LM3421Q1,

−40

125

°C

Operating junction

LM3423, LM3423Q1

temperature

LM3421Q0, LM3423Q0

−40

150

°C

Input voltage VIN

4.5

6.4 Thermal Information

LM3421,

LM3423,

LM3421-Q1

LM3423-Q1

THERMAL METRIC(1)

UNIT

PWP (HTSSOP)

16 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

38.9

36.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

23.1

21.5

°C/W

RθJB

Junction-to-board thermal resistance

16.8

°C/W

ψJT

Junction-to-top characterization parameter

0.6

0.5

°C/W

ψJB

Junction-to-board characterization parameter

16.6

17.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.7

1.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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Product Folder Links: LM3421 LM3421-Q1 LM3423 LM3423-Q1

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