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DM505 Datasheet(PDF) 95 Page - Texas Instruments |
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DM505 Datasheet(HTML) 95 Page - Texas Instruments |
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95 / 286 page ![]() 95 DM505 www.ti.com SPRS976A – NOVEMBER 2016 – REVISED JANUARY 2017 Submit Documentation Feedback Specifications Copyright © 2016–2017, Texas Instruments Incorporated Table 5-13. Analog-to-Digital ADC Subsystem Electrical Specifications (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITIONS MIN NOM MAX UNIT Signal-to-Noise Plus Distortion 1.8 Vpp, 30 kHz sine wave 50 dB adc_vrefp Input Impedance 20 Ω Sampling Dynamics Time from Start to Start 17 Clock Cycles Conversion Time + Error Correction 10 + 1 Clock Cycles Acquisition time 4 Clock Cycles Throughput Rate CLK = 20 MHz (Pin : clk) 1 MSPS Channel to Channel Isolation 90 dB ADC Clock Frequency See Table 5-1 MHz (1) Connect adc_vrefp to vdda_adc when not using a positive external reference voltage. (2) This parameter is valid when the respective AIN terminal is configured to operate as a general-purpose ADC input. (3) The maximum sample rate assumes a conversion time of 13 ADC clock cycles with the acquisition time configured for the minimum of 2 ADC clock cycles, where it takes a total of 15 ADC clock cycles to sample the analog input and convert it to a positive binary weighted digital value. 5.8 Thermal Characteristics For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in , Recommended Operating Conditions. A BCI compact thermal model for this Device is available and recommended for use when modeling thermal performance in a system. Therefore, it is recommended to perform thermal simulations at the system level with the worst case device power consumption. 5.8.1 Package Thermal Characteristics Table 5-14 provides the thermal resistance characteristics for the package used on this device. NOTE Power dissipation of 4.14 W and an ambient temperature of 65ºC is assumed for ABF package. Table 5-14. Thermal Resistance Characteristics NO. PARAMET ER DESCRIPTION °C/W(1) AIR FLOW (m/s)(2) T1 RΘJC Junction-to-case 1.41 N/A T2 RΘJB Junction-to-board 5.96 N/A T3 RΘJA Junction-to-free air 15.4 0 T4 Junction-to-moving air 13.1 1 T5 12.2 2 T6 11.6 3 T7 ΨJT Junction-to-free air 0.94 0 T8 Junction-to-package top 0.94 1 T9 0.94 2 T10 0.94 3 |
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