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DM505 Datasheet(PDF) 95 Page - Texas Instruments

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Part # DM505
Description  SoC for Radar and Vision Analytics 15mm Package (ABF) Silicon Revision 2.0
PDF  286 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DM505 Datasheet(HTML) 95 Page - Texas Instruments

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95
DM505
www.ti.com
SPRS976A – NOVEMBER 2016 – REVISED JANUARY 2017
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Specifications
Copyright © 2016–2017, Texas Instruments Incorporated
Table 5-13. Analog-to-Digital ADC Subsystem Electrical Specifications (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
NOM
MAX
UNIT
Signal-to-Noise Plus
Distortion
1.8 Vpp, 30 kHz sine wave
50
dB
adc_vrefp Input Impedance
20
Ω
Sampling Dynamics
Time from Start to Start
17
Clock Cycles
Conversion Time + Error Correction
10 + 1
Clock Cycles
Acquisition time
4
Clock Cycles
Throughput Rate
CLK = 20 MHz (Pin : clk)
1
MSPS
Channel to Channel Isolation
90
dB
ADC Clock Frequency
See
Table 5-1
MHz
(1) Connect adc_vrefp to vdda_adc when not using a positive external reference voltage.
(2) This parameter is valid when the respective AIN terminal is configured to operate as a general-purpose ADC input.
(3) The maximum sample rate assumes a conversion time of 13 ADC clock cycles with the acquisition time configured for the minimum of 2
ADC clock cycles, where it takes a total of 15 ADC clock cycles to sample the analog input and convert it to a positive binary weighted
digital value.
5.8
Thermal Characteristics
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or
below the TJ value identified in , Recommended Operating Conditions.
A BCI compact thermal model for this Device is available and recommended for use when modeling
thermal performance in a system.
Therefore, it is recommended to perform thermal simulations at the system level with the worst case
device power consumption.
5.8.1
Package Thermal Characteristics
Table 5-14 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 4.14 W and an ambient temperature of 65ºC is assumed for ABF
package.
Table 5-14. Thermal Resistance Characteristics
NO.
PARAMET
ER
DESCRIPTION
°C/W(1)
AIR FLOW (m/s)(2)
T1
RΘJC
Junction-to-case
1.41
N/A
T2
RΘJB
Junction-to-board
5.96
N/A
T3
RΘJA
Junction-to-free air
15.4
0
T4
Junction-to-moving air
13.1
1
T5
12.2
2
T6
11.6
3
T7
ΨJT
Junction-to-free air
0.94
0
T8
Junction-to-package top
0.94
1
T9
0.94
2
T10
0.94
3



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