AD9163BBCZ datasheet(10/124 Pages) AD

10 / 124 page

Data Sheet

AD9163

Rev. 0 | Page 9 of 123

ABSOLUTE MAXIMUM RATINGS

Table 10.

Parameter

Rating

ISET, VREF to VBG_NEG

−0.3 V to VDD25_DAC + 0.3 V

SERDINx±, VTT_1P2,

SYNCOUT±

−0.3 V to SYNC_VDD_3P3 + 0.3 V

OUTPUT± to VNEG_N1P2

−0.3 V to VDD25_DAC + 0.3 V

SYSREF±

GND − 0.5 V to +2.5 V

CLK± to Ground

−0.3 V to VDD12_CLK + 0.3 V

RESET, IRQ, CS, SCLK, SDIO,

SDO to Ground

−0.3 V to IOVDD + 0.3 V

Junction Temperature1

fDAC = 6 GSPS

105°C

fDAC ≤ 5.1 GSPS

110°C

Ambient Operating

Temperature Range (TA)

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

1 Some operating modes of the device may cause the device to approach or

exceed the maximum junction temperature during operation at supported

ambient temperatures. Removal of heat from the device may require

additional measures such as active airflow, heat sinks, or other measures.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

REFLOW PROFILE

The AD9163 reflow profile is in accordance with the JEDEC

JESD204B criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL MANAGEMENT

The AD9163 is a high power device that can dissipate nearly

3 W depending on the user application and configuration.

Because of the power dissipation, the AD9163 uses an exposed

die package to give the customer the most effective method of

controlling the die temperature. The exposed die allows cooling

of the die directly.

Figure 3 shows the profile view of the device mounted to a user

printed circuit board (PCB) and a heat sink (typically the

aluminum case) to keep the junction (exposed die) below the

maximum junction temperature in Table 10.

CUSTOMER CASE (HEAT SINK)

CUSTOMER THERMAL FILLER

SILICON (DIE)

IC PROFILE

PACKAGE SUBSTRATE

CUSTOMER PCB

Figure 3. Typical Thermal Management Solution

THERMAL RESISTANCE

Typical θJA and θJC values are specified for a 4-layer JEDEC 2S2P

high effective thermal conductivity test board for balled

surface-mount packages. θJA is obtained in still air conditions

(JESD51-2). Airflow increases heat dissipation, effectively reducing

θJA. θJC is obtained with the test case temperature monitored at

the bottom of the package.

ΨJT is thermal characteristic parameters obtained with θJA in still

air test conditions but are not applicable to the CSP_BGA package.

Estimate the junction temperature (TJ) using the following

equations:

TJ = TT + (ΨJT × PDISS)

where:

TT is the temperature measured at the top of the package.

PDISS is the total device power dissipation.

Table 11. Thermal Resistance

Package Type

θJA

θJC

Unit

BC-169-2

14.6

0.02

°C/W

ESD CAUTION

AD9163BBCZ Datasheet(PDF) 10 Page - Analog Devices

AD9163BBCZ Datasheet(HTML) 10 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL