S71PL254 datasheet(118/196 Pages) SPANSION

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118

pSRAM Type 4

pSRAM_Type04_18A0 August 30, 2004

Advance

I n f o rmation

Capacitance

Note: Tested initially and after any design or process changes that may affect these parameters.

Thermal Resistance

Note: Tested initially and after any design or process changes that may affect these parameters.

AC Test Loads and Waveforms

Parameter

Description

Test Condition

Max

Unit

CIN

Input Capacitance

TA = 25°C, f = 1 MHz,

VCC = VCC(typ.)

COUT

Output Capacitance

Parameter

Description

Test Conditions

VFBGA

Unit

θ JA

Thermal Resistance (Junction to Ambient) Test conditions follow standard test methods

and procedures for measuring thermal

impedance, per EIA / JESD51.

°C/W

θ JC

Thermal Resistance (Junction to Case)

Figure 43. AC Test Loads and Waveforms

Parameters

3.0V VCC

Unit

22000

Ω

22000

RTH

11000

VTH

1.50

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

OUTPUT

VTH

Equivalent to:

THÉVENIN EQUIVALENT

ALL INPUT PULSES

RTH

Rise Time: 1 V/ns

Fall Time: 1 V/ns

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