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SIM6800M Datasheet(PDF) 20 Page - Sanken electric

Part # SIM6800M
Description  500V / 600V High Voltage 3-phase Motor Driver ICs
PDF  52 Pages
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Manufacturer  SANKEN [Sanken electric]
Direct Link  http://www.sanken-ele.co.jp/en
Logo SANKEN - Sanken electric

SIM6800M Datasheet(HTML) 20 Page - Sanken electric

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SIM6800M Series
SIM6800M-DSE Rev.1.5
SANKEN ELECTRIC CO., LTD
20
Jul. 18, 2018
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2014
VCC1
VB1B
VB3
W2
U
COM2
VCC2
COM1
W1
V1
VBB
V
VB2
VCC
CBOOT1
CBOOT3
CBOOT2
M
MIC
5
6
16
17
23
24
26
28
30
31
37
20
19
HO1
HO2
HO3
DBOOT1
DBOOT2
DBOOT3
RBOOT1
RBOOT2
RBOOT3
VDC
Figure 12-1.
Bootstrap Circuit
Figure 12-2 shows an internal level-shifting circuit. A
high-side output signal, HOx, is generated according to
an input signal on the HINx pin. When an input signal
on the HINx pin transits from low to high (rising edge),
a “Set” signal is generated. When the HINx input signal
transits from high to low (falling edge), a “Reset” signal
is generated. These two signals are then transmitted to
the high-side by the level-shifting circuit and are input to
the SR flip-flop circuit. Finally, the SR flip-flop circuit
feeds an output signal, Q (i.e., HOx).
Figure 12-3 is a timing diagram describing how noise
or other detrimental effects will improperly influence the
level-shifting process. When a noise-induced rapid
voltage drop between the VBx and output pins (U, V or
W1; hereafter “VBx–HSx”) occurs after the Set signal
generation, the next Reset signal cannot be sent to the
SR flip-flop circuit. And the state of an HOx signal stays
logic high (or “H”) because the SR flip-flop does not
respond. With the HOx state being held high (i.e., the
high-side transistor is in an on-state), the next LINx
signal turns on the low-side transistor and causes a
simultaneously-on condition, which may result in
critical damage to the IC. To protect the VBx pin against
such a noise effect, add a bootstrap capacitor, CBOOTx, in
each phase. CBOOTx must be placed near the IC, and be
connected between the VBx and HSx pins with a
minimal length of traces. To use an electrolytic capacitor,
add a 0.01 μF to 0.1 μF bypass capacitor, C
Px, in parallel
near these pins used for the same phase.
HINx
Input
logic
Pulse
generator
COM1
Set
Reset
HOx
VBx
HSx
S
R
Q
U1
16
Figure 12-2.
Internal Level-shifting Circuit
HINx
Set
Reset
VBx–HSx
Q
0
VBS(OFF)
0
0
0
0
VBS(ON)
Stays logic high
Figure 12-3.
Waveforms at VBx–HSx Voltage Drop
12.2.3
VCC1 and VCC2
These are the power supply pins for the built-in
control IC. The VCC1 and VCC2 pins must be
externally connected on a PCB because they are not
internally connected. To prevent malfunction induced by
supply ripples or other factors, put a 0.01 μF to 0.1 μF
ceramic capacitor, CVCC, near these pins. To prevent
damage caused by surge voltages, put an 18 V to 20 V
Zener diode, DZ, between the VCCx and COMx pins.
Voltages to be applied between the VCCx and COMx
pins should be regulated within the recommended
operational range of VCC, given in Section 2.
VCC1
COM2
VCC2
COM1
VCC
MIC
5
6
16
17
CVCC
DZ
Figure 12-4.
VCCx Pin Peripheral Circuit
12.2.4
COM1 and COM2
These are the logic ground pins for the built-in control
IC. The COM1 and COM2 pins should be connected
externally on a PCB because they are not internally
connected. Varying electric potential of the logic ground
can be a cause of improper operations. Therefore,
connect the logic ground as close and short as possible
to shunt resistors, RSx, at a single-point ground (or star
ground) which is separated from the power ground (see
Figure 12-5).



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