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SIM6800M Datasheet(PDF) 20 Page - Sanken electric |
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SIM6800M Datasheet(HTML) 20 Page - Sanken electric |
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20 / 52 page ![]() SIM6800M Series SIM6800M-DSE Rev.1.5 SANKEN ELECTRIC CO., LTD 20 Jul. 18, 2018 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2014 VCC1 VB1B VB3 W2 U COM2 VCC2 COM1 W1 V1 VBB V VB2 VCC CBOOT1 CBOOT3 CBOOT2 M MIC 5 6 16 17 23 24 26 28 30 31 37 20 19 HO1 HO2 HO3 DBOOT1 DBOOT2 DBOOT3 RBOOT1 RBOOT2 RBOOT3 VDC Figure 12-1. Bootstrap Circuit Figure 12-2 shows an internal level-shifting circuit. A high-side output signal, HOx, is generated according to an input signal on the HINx pin. When an input signal on the HINx pin transits from low to high (rising edge), a “Set” signal is generated. When the HINx input signal transits from high to low (falling edge), a “Reset” signal is generated. These two signals are then transmitted to the high-side by the level-shifting circuit and are input to the SR flip-flop circuit. Finally, the SR flip-flop circuit feeds an output signal, Q (i.e., HOx). Figure 12-3 is a timing diagram describing how noise or other detrimental effects will improperly influence the level-shifting process. When a noise-induced rapid voltage drop between the VBx and output pins (U, V or W1; hereafter “VBx–HSx”) occurs after the Set signal generation, the next Reset signal cannot be sent to the SR flip-flop circuit. And the state of an HOx signal stays logic high (or “H”) because the SR flip-flop does not respond. With the HOx state being held high (i.e., the high-side transistor is in an on-state), the next LINx signal turns on the low-side transistor and causes a simultaneously-on condition, which may result in critical damage to the IC. To protect the VBx pin against such a noise effect, add a bootstrap capacitor, CBOOTx, in each phase. CBOOTx must be placed near the IC, and be connected between the VBx and HSx pins with a minimal length of traces. To use an electrolytic capacitor, add a 0.01 μF to 0.1 μF bypass capacitor, C Px, in parallel near these pins used for the same phase. HINx Input logic Pulse generator COM1 Set Reset HOx VBx HSx S R Q U1 16 Figure 12-2. Internal Level-shifting Circuit HINx Set Reset VBx–HSx Q 0 VBS(OFF) 0 0 0 0 VBS(ON) Stays logic high Figure 12-3. Waveforms at VBx–HSx Voltage Drop 12.2.3 VCC1 and VCC2 These are the power supply pins for the built-in control IC. The VCC1 and VCC2 pins must be externally connected on a PCB because they are not internally connected. To prevent malfunction induced by supply ripples or other factors, put a 0.01 μF to 0.1 μF ceramic capacitor, CVCC, near these pins. To prevent damage caused by surge voltages, put an 18 V to 20 V Zener diode, DZ, between the VCCx and COMx pins. Voltages to be applied between the VCCx and COMx pins should be regulated within the recommended operational range of VCC, given in Section 2. VCC1 COM2 VCC2 COM1 VCC MIC 5 6 16 17 CVCC DZ Figure 12-4. VCCx Pin Peripheral Circuit 12.2.4 COM1 and COM2 These are the logic ground pins for the built-in control IC. The COM1 and COM2 pins should be connected externally on a PCB because they are not internally connected. Varying electric potential of the logic ground can be a cause of improper operations. Therefore, connect the logic ground as close and short as possible to shunt resistors, RSx, at a single-point ground (or star ground) which is separated from the power ground (see Figure 12-5). |
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