SIM6800M datasheet(23/52 Pages) SANKEN

23 / 52 page

SIM6800M Series

SIM6800M-DSE Rev.1.5

SANKEN ELECTRIC CO., LTD

Jul. 18, 2018

http://www.sanken-ele.co.jp/en

trace length between the FO and COMx pins.

To avoid the repetition of OCP activations, the

external microcontroller must shut off any input signals

to the IC within an OCP hold time, tP, which occurs after

the internal transistor (QFO) turn-on. tP

is 15 μs where

minimum values of thermal characteristics are taken into

account. (For more details, see Section 12.3.5.) Our

recommendation is to use a

0.001 μF to 0.01 μF filter

capacitor.

12.3 Protection Functions

This section describes the various protection circuits

provided in the SIM6800M series. The protection

circuits include the undervoltage lockout for power

supplies (UVLO), the overcurrent protection (OCP), and

the thermal shutdown (TSD). In case one or more of

these protection circuits are activated, the FO pin

outputs a fault signal; as a result, the external

microcontroller can stop the operations of the three

phases by receiving the fault signal. The external

microcontroller can also shut down the IC operations by

inputting a fault signal to the FO pin.

In the following functional descriptions, “HOx”

denotes a gate input signal on the high-side transistor,

whereas “LOx” denotes a gate input signal on the low-

side transistor..

12.3.1

Fault Signal Output

In case one or more of the following protections are

actuated, an internal transistor, QFO, turns on, then the

FO pin becomes logic low

(≤0.5 V).

1) Low-side undervoltage lockout (UVLO_VCC)

2) Overcurrent protection (OCP)

3) Thermal shutdown (TSD)

While the FO pin is in the low state, all the low-side

transistors turn off. In normal operation, the FO pin

outputs a high signal of 5 V.. The fault signal output

time of the FO pin at OCP activation is the OCP hold

time (tP) of 25

μs (typ.), fixed by a built-in feature of the

itself

(see

Section

12.3.5).

The

external

microcontroller receives the fault signals with its

interrupt pin (INT), and must be programmed to put the

HINx

and

LINx

pins

logic

low

within

the

predetermined OCP hold time, tP.

12.3.2

Shutdown Signal Input

The FO pin also acts as the input pin of shutdown

signals. When the FO pin becomes logic low, all the

low-side transistors turn off.

The voltages and pulse widths of the shutdown signals

to be applied between the FO and COMx pins are listed

in Table 12-2.

Table 12-2.

Shutdown Signals

Parameter

High Level Signal

Low Level Signal

Input Voltage

3 V < VIN < 5.5 V

0 V < VIN < 0.5 V

Input Pulse

Width

—

≥6 μs

12.3.3

Undervoltage Lockout for

Power Supply (UVLO)

In case the gate-driving voltages of the output

transistors decrease, their steady-state power dissipations

increase.

This

overheating

condition

may

cause

permanent damage to the IC in the worst case. To

prevent this event, the SIM6800M series has the

undervoltage lockout (UVLO) circuits for both of the

high- and low-side power supplies in the monolithic IC

(MIC).

12.3.3.1. Undervoltage Lockout for

High-side Power Supply

(UVLO_VB)

Figure 12-10 shows operational waveforms of the

undervoltage lockout operation for high-side power

supply (i.e., UVLO_VB).

LINx

HINx

VBx-HSx

HOx

LOx

VBS(OFF)

VBS(ON)

No FO output at

UVLO_VB.

UVLO release

UVLO_VB

operation

About 3 µs

HOx restarts at

positive edge after

UVLO_VB release.

Figure 12-10.

UVLO_VB Operational Waveforms

When the voltage between the VBx and output pins

(VBx–HSx shown in Figure 12-10) decreases to the

Logic Operation Stop Voltage (VBS(OFF), 10.0 V) or less,

the UVLO_VB circuit in the corresponding phase gets

SIM6800M Datasheet(PDF) 23 Page - Sanken electric

SIM6800M Datasheet(HTML) 23 Page - Sanken electric

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52

Datasheet Download

Link URL