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TAS2563 Datasheet(PDF) 67 Page - Texas Instruments

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Part # TAS2563
Description  TAS2563 6.1-W Boosted Class-D Audio Amplifier With Integrated DSP And IV Sense
PDF  127 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TAS2563 Datasheet(HTML) 67 Page - Texas Instruments

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Table 8-88. Clock Halt Timer (continued)
CLK_HALT_TIMER[2:0]
Setting
101
209.71 ms
110
419.43 ms
111
838.86 ms
8.4.8 Thermal Foldback
The TAS2563 monitors the die temperature and can automatically limit the audio signal when the die
temperature reaches a set threshold. It is recommended to use Section 8.3.1 to configure the thermal foldback
as the software will perform the necessary math for each register.
Thermal foldback can be disabled using TF_EN. If the die temperature reaches TF_TEMP_TH this feature will
begin to attenuate the audio signal to prevent the device from shutting down due to over-temperature. It will
attenuate the audio signal by TF_LIMS db per degree of temperature over TF_TEMP_TH. The thermal foldback
with attack at a fixed rate of 0.25 dB per sample. A maximum attenuation of TF_MAX_ATTN can be specified.
However if the device continue to heat up eventually the device over-temperature will be triggered. The
attenuation will be held for TF_HOLD_CNT samples before the attenuation will begin releasing.
Table 8-89. Thermal Foldback Enable
TF_EN
SETTING
0
Disabled
1
Enabled (default)
Table 8-90. Thermal Foldback Registers
REGISTER
DESCRIPTION
CALCULATION
TF_LIMS
Thermal foldback
limiter slope (in
db/°C)
round(10^(-slope /
20)*2^31)
TF_HOLD_CNT
Thermal foldback hold
count (samples)
round(seconds *
1000)
TF_REL_RATE
Thermal foldback
limiter release rate
(db/samples)
round(10^(dB per
sample / 20)*2^30)
TF_TEMP_TH
Thermal foldback
limiter temperature
threshold (°C)
round(°C * 2^23)
TF_MAX_ATTN
Thermal foldback max
gain reduction (dB)
round(10^(max attn
dB/20)*2^31)
www.ti.com
TAS2563
SLASET3B – FEBRUARY 2020 – REVISED DECEMBER 2020
Copyright © 2020 Texas Instruments Incorporated
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