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THS4521 Datasheet(PDF) 36 Page - Texas Instruments |
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THS4521 Datasheet(HTML) 36 Page - Texas Instruments |
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36 / 51 page  Ground and power plane removed from inner layers. Ground fill on outer layers also removed. Ground and power plane exist on inner layers. Place the feedback resistors, RF±, gain resistors, RG±, and the isolation resistors, RO±, as close to the device pins as possible to minimize parasitics 4 3 1 5 8 IN± VOCM VS+ IN+ VS± OUT± CL RT+ RS+ RT± VIN PD 2 7 6 Vias to connect supply pins to CBYP. Place CBYP capacitors on the other side of the PCB as close to the vias as possible. OUT+ Remove GND and Power plane under output and inverting pins to minimize stray PCB capacitance Figure 12-2. Layout Recommendations THS4561 SBOS874C – AUGUST 2017 – REVISED DECEMBER 2020 www.ti.com 36 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: THS4561 |
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