Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 5

7.1 Absolute Maximum Ratings ....................................... 5

7.2 ESD Ratings .............................................................. 5

7.3 Recommended Operating Conditions ........................5

7.4 Thermal Information ...................................................5

7.5 Electrical Characteristics: VS+ – VS– = 5 V to 12 V .... 6

7.6 Typical Characteristics: (VS+) – (VS–) = 12 V.............. 9

7.7 Typical Characteristics: (VS+) – (VS–) = 5 V.............. 12

7.8 Typical Characteristics: (VS+) – (VS–) = 3 V.............. 15

7.9 Typical Characteristics: (VS+) – (VS–) = 3-V to

12-V Supply Range..................................................... 16

8 Parameter Measurement Information.......................... 19

8.1 Example Characterization Circuits............................19

8.2 Output Interface Circuit for DC-Coupled

Differential Testing.......................................................21

8.3 Output Common-Mode Measurements.....................21

8.4 Differential Amplifier Noise Measurements...............22

8.5 Balanced Split-Supply Versus Single-Supply

Characterization.......................................................... 22

8.6 Simulated Characterization Curves.......................... 22

8.7 Terminology and Application Assumptions............... 23

9 Detailed Description......................................................24

9.1 Overview................................................................... 24

9.2 Functional Block Diagram......................................... 24

9.3 Feature Description...................................................25

9.4 Device Functional Modes..........................................25

10 Application and Implementation................................ 28

10.1 Application Information........................................... 28

10.2 Typical Application.................................................. 33

11 Power Supply Recommendations..............................34

12 Layout...........................................................................35

12.1 Layout Guidelines................................................... 35

12.2 Layout Examples.................................................... 35

13 Device and Documentation Support..........................37

13.1 Receiving Notification of Documentation Updates..37

13.2 Support Resources................................................. 37

13.3 Trademarks.............................................................37

13.4 Electrostatic Discharge Caution..............................37

13.5 Glossary..................................................................37

14 Mechanical, Packaging, and Orderable

Information.................................................................... 37

4 Revision History

Changes from Revision B (August 2020) to Revision C (December 2020)

Page

• Changed the slew rate from 315 V/µs to 230 V/µs in the Features section........................................................1

• Updated Gain of 10 V/V PCM Audio DAC Output with Second-Order MFB Filter at 50 kHz in the Features

section................................................................................................................................................................ 1

• Releasing the WQFN (10) package for the in the THS4561 device................................................................... 1

• Changed the status of the RUN package from preview to production ...............................................................4

• Seperated slew rate specification into rising and falling specifications lines...................................................... 5

from 23 MHz to 22 MHz .....................................................................................................................................5

• Changed the VOCM large-signal bandwidth typical value from 10 MHz to 1.9 MHz .........................................5

• Changed the maximum VOCM drift specification from 300 µV/°C .................................................................... 5

• Updated the Common-Mode Voltage, Small-Signal and Large-Signal Response (VOCM Pin Driven) figure in

• Updated the MFB Filter Driving an ADC Application: Example 170-kHz Butterworth Response figure in the

Typical Application section ...............................................................................................................................33

Changes from Revision A (December 2019) to Revision B (August 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added the VQFN-10 and VQFN-16 Package Outlines.....................................................................................37

Changes from Revision * (August 2017) to Revision A (December 2019)

Page

• Changed device status from advance information to production data................................................................1

THS4561

SBOS874C – AUGUST 2017 – REVISED DECEMBER 2020

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