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LTC3124 Datasheet(PDF) 17 Page - Analog Devices |
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LTC3124 Datasheet(HTML) 17 Page - Analog Devices |
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17 / 36 page ![]() LT3120 17 Rev. 0 For more information www.analog.com The value for RSEN should be selected to limit the maximum voltage between ISP and ISN to 25mV at current limit. For current monitoring applications, the values for RSEN and RPROG should be selected to not exceed 700mV on the PROG pin. When current sensing is not used, the ISP and ISN pins should be tied to PVOUT and the PROG pin should be tied to VCC. Burst Mode OPERATION When the SYNC/MODE pin is held low, the LT3120 is configuredforBurstModeoperation.Asaresult,thebuck- boost DC/DC converter will operate with continuous PWM switching until the output current drops to low levels at which point the converter will automatically transition to power saving Burst Mode operation. When operating in Burst Mode operation, the LT3120 will go into a sleep state when the output voltage achieves its nominal regulation level. The sleep state halts PWM switching and powers down all nonessential functions of the IC, reducing the quiescentcurrentoftheLT3120tojust30µA(typical).This greatly improves overall power conversion efficiency for light loads. Since the converter is not switching in sleep, the output voltage will slowly decay at a rate determined by the output load resistance and the output capacitor value. When the output voltage has decayed by a small amount, the LT3120 will wake and initiate PWM switching operation until the output voltage on VOUT is restored to the previous level. If the load is very light, the LT3120 may only need to switch for a few cycles to restore VOUTandwill sleep for extended periods of time, significantly improv- ing efficiency. If the load is suddenly increased above the burst transition threshold, the part will automatically enter continuous PWM operation until the load is once again reduced. Note that Burst Mode operation is inhibited until soft-start is completed and VOUT has reached regulation. Burst Mode operation is also inhibited when the MPPC loop is in control. OPERATION POWER GOOD INDICATOR The LT3120 provides an open-drain PGOOD output that pulls low if VOUTfallsmorethan8%(typical)belowitspro- grammed value. When VOUT rises to within 6.8% (typical) of its programmed value, the internal PGOOD pull-down will turn off and PGOOD will go high if an external pull- up resistor has been provided. An internal filter prevents nuisance trips of PGOOD due to short transients on VOUT. Note that PGOOD can be pulled up to any voltage, as long as the absolute maximum rating of 27V is not exceeded. The PGOOD function is active when the EN/UVLO pin volt- age is above the logic enable threshold of 0.8V (typical). When the EN/UVLO pin voltage is below 0.8V (typical) and the VCC supply is still present, the PGOOD pull-down will be enabled. THERMAL CONSIDERATIONS The power switches in the LT3120 are designed to oper- ate continuously with currents up to the internal current limit thresholds. Operating at high current levels results in significant heat generated within the IC. In addition, in many applications the VCC regulator is operated with large input-to-outputvoltagedifferentialsresultinginsignificant additional power dissipation in the pass element. As a result, careful consideration must be given to the thermal environment of the IC in order to optimize efficiency and ensure that the LT3120 is able to provide its full-rated output current. Specifically, the exposed thermal pad of the LQFN must be soldered to the PC board. The PC board shouldbedesignedtomaximizetheconductionofheatout of the IC package, maximizing vias from the thermal pad connection to a large area of exposed copper. Additional benefit can be realized through the use of thinner printed circuit boards, and higher layer counts with internal layers tied to the thermal vias. These steps minimize thermal resistance of the PCB, allowing for operation over a wider temperature range and greater output current levels. If the die temperature exceeds approximately 165°C, the IC will enter overtemperature shutdown and all switching will be inhibited. The part will remain disabled until the die cools by approximately 10°C. The soft-start circuit is re-initialized in over temperature shutdown to provide a smooth recovery when the fault condition is removed. |
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