LTC3124 datasheet(2/36 Pages) AD

2 / 36 page

LT3120

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, PVIN, PVOUT, EN/UVLO, PGOOD ......... –0.3V to 27V

FB, VC, RT, SYNC/MODE, MPPC, VCC .......... –0.3V to 6V

BST1 ..................................(SW1 – 0.3V) to (SW1 + 6V)

BST2..................................(SW2 – 0.3V) to (SW2 + 6V)

BST3.............................(PVOUT – 0.3V) to (PVOUT + 6V)

Operating Junction Temperature (Note 2)

LT3120J............................................. –40°C to 150°C

Storage Temperature Range .................. –65°C to 150°C

Maximum Reflow (Package Body) Temperature ...260°C

(Note 1)

9 10

TOP VIEW

LQFN PACKAGE

28-LEAD (4mm × 5mm) LGA

TJMAX = 150°C, θJA = 20°C/W

EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB

11 12 13

28 27 26 25 24

BST3

PVOUT

GND

PVOUT

ISP

ISN

PGOOD

PROG

GND

PVIN

GND

VIN

EN/UVLO

SYNC/MODE

PGND

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LT3120JV#PBF

Au (RoHS)

3120

LQFN (Laminate Package

with QFN Footprint)

–40°C to 150°C

• Contact the factory for parts specified with wider operating

temperature ranges. *Pad or ball finish code is per IPC/JEDEC

J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing Procedures

• LGA and BGA Package and Tray Drawings

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