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IMX8ULPIEC Datasheet(PDF) 24 Page - NXP Semiconductors

Part # IMX8ULPIEC
Description  i.MX 8ULP Applications Processor-Industrial Products
PDF  100 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMX8ULPIEC Datasheet(HTML) 24 Page - NXP Semiconductors

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Table 5. Analog PMC rise and fall trip point specifications (continued)
Rise
Fall
Fuse setting
Min
Typ
Max
Min
Typ
Max
HVD1
1.232
1.252
1.272
1.209
1.229
1.249
HVD2
1.232
1.252
1.272
1.209
1.229
1.249
HVD3
1.232
1.252
1.272
1.209
1.229
1.249
4 System specifications
4.1 Ratings
4.1.1 Thermal handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
TSTG
Storage temperature
-55
150
°C
1
TSDR
Solder temperature, lead-free
—
260
°C
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.1.2 Moisture handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
MSL
Moisture sensitivity level
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.1.3 ESD handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
VHBM
Electrostatic discharge voltage, human body model
-1000
+1000
V
1
VCDM
Electrostatic discharge voltage, charged-device model
-250
+250
V
2
1. Determined according to JEDEC Standard JS-001,
JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC
DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL.
2. Determined according to JEDEC Standard JS-002,
ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC
DISCHARGE SENSITIVITY TESTING – CHARGED DEVICE MODEL (CDM) – DEVICE LEVEL.
NXP Semiconductors
System specifications
i.MX 8ULP Applications Processor—Industrial Products, Rev. 1, 09/2023
Data Sheet: Technical Data
24 / 100



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