| Electronic Components Datasheet Search |
|
STPMIC25 Datasheet(PDF) 54 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STPMIC25 Datasheet(HTML) 54 Page - STMicroelectronics |
|
54 / 145 page ![]() Figure 18. Reset power-cycle sequence example christophe belet ST Microelectonics POWER_DOWN POWER_ON RSTn PMIC State RANK1 (LDO1) mask_reset RANK3 (BUCK1/2) RANK0 RANK5 RANK4 RANK3 RANK4 (LDO4) RANK0 (BUCK6) RST Enable BUCK6 by I²C CHECK& LOAD POWER_UP RANK1 RANK2 RANK3 POWER_ON RSTn asserted by AP RANK2 RANK1 RANK4 RANK5 RANK2 (BUCK4) RSTn released by PMIC RSTn released by AP RST (2) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (2) 7 ms ? (1): RANK_DLY[1:0] (2): RST_DLY[1:0] For RANK_DLY and RST_DLY see Table 91 Settings related to the example in Figure 18: LDO1 with mask_reset option set (LDOS_MRST_CR[LDO1_MRST] = 1), is not impacted by the reset power- cycle. BUCK1, BUCK2, BUCK4, and LDO4 are powered down and up at their respective ranks defined in the NVM. BUCK6 is enabled by I2C. So, it is powered down first and not restarted (as not defined in the NVM to start). mask_reset is valid once. It is cleared in the CHECK&LOAD state. So, it is cleared following a turn-OFF condition, a VINPOR, and a RSTn assertion. When RSTn is released by the application processor, the PMIC keeps RSTn asserted (the RSTn signal keeps low) meaning that the application processor is kept in reset until the PMIC releases the RSTn signal. 5.4.8 Thermal protection The PMIC implements a thermal protection to prevent overheating damage. PMIC junction temperature is permanently monitored by an embedded thermal sensor. The first level of thermal protection consists of an alarm sent by an interrupt to the application processor: • When Tj rises above the TWRN_Rise threshold, the PMIC generates an THW_RI interrupt • When Tj falls below the TWRN_Fall threshold, the PMIC generates an THW_FA interrupt The application processor can manage to decrease the application activity load to decrease the application power consumption. Alternatively, a second level of thermal protection may occur. The second level of thermal protection consists of triggering a turn-OFF hard-fault condition: • When Tj rises above the TSHDN_Rise threshold, the PMIC generates a turn-OFF hard-fault condition, and the thermal fail-safe counter is incremented (TSHDN_FLT_CNT ++): – If the thermal fail-safe counter reaches the maximum number of power cycles defined in the NVM (TSHDN_FLT_CNT > TSHDN_FLT_CNT_MAX) then the PMIC goes into the FAIL_SAFE_LOCK state. – Alternatively, when Tj falls below the TSHDN_Fall threshold and a tTSHDN_DLY delay ends, the PMIC restarts. See Section 5.4.5 for details about fail-safe counter management. STPMIC25 Feature descriptions DS14278 - Rev 3 page 54/145 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |