STPMIC25BPQR datasheet(4/145 Pages) STMICROELECTRONICS

4 / 145 page

2.1

Recommended external components

Table 2. Passive components

Component

Manufacturer

Part number

Value

Size

CVIN, CLDO1OUT, CLDO2OUT, CLDO4OUT,

CLDO5OUT, CLDO6OUT, CLDO7OUT, CLDO8OUT,

CINTLDO

MURATA

GRM155R60J475ME47D

4.7 µF, 6.3 V

0402

CBUCK1IN, BUCK2IN, CBUCK3IN, CBUCK4IN,

CBUCK5IN, CBUCK6IN, CBUCK7IN

GRM188R61A106ME69D

10 µF, 10 V

0603

CVOUT1, CVOUT6

GRM188R60J226MEA0D

3 x 22 µF, 6.3 V

0603

CVOUT2, CVOUT3

4 x 22 µF, 6.3 V

CVOUT4, CVOUT5

GRM21BR61A226ME51L

3 x 22 µF, 10 V

0805

CVOUT7

4 x 22 µF, 10 V

CLDO12IN, CLDO56IN, CLDO78IN, CVREF

GRM155R61E105KA12D

1 µF, 25 V

0402

CLDO3IN, CLDO3OUT (1)

GRM155R60J106ME05D

10 µF, 6.3 V

0402

CVBUS

GRM188R61C475KE11D

4.7 µF, 16 V

0603

LX1, LX6, LX7

DFE201610E-R68M=P2

0.68 µH

0806

LX2, LX3

DFE252012F-R68M=P2

0.68 µH

1008

LX4, LX5

DFE201610E-2R2M=P2

2.2 µH

0806

1. 4.7 μF normal mode - 10 μF sink/source mode.

Note:

All the components above refer to a typical application working in an environment up to +85 °C ambient

temperature. The operation of the device is not limited to the choice of these external components. For different

environment application needs, see the forthcoming application note.

STPMIC25

Typical application schematic

DS14278 - Rev 3

page 4/145

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