AM69 datasheet(156/312 Pages) TI

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It is recommended to perform thermal simulations at the system level with the worst case device power consumption.

NO.

PARAMETER

DESCRIPTION

AND PACKAGE

°C/W(1) (3)

AIR FLOW

(m/s)(2)

T11

ΨJB

Junction-to-board

1.30

T12

1.23

T13

1.18

(1)

These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Packages

(2)

m/s = meters per second.

(3)

°C/W = degrees Celsius per watt.

AM69A, AM69

SPRSP92C – FEBRUARY 2023 – REVISED JUNE 2024

www.ti.com

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AM69 Datasheet(PDF) 156 Page - Texas Instruments