IMX91CEC datasheet(9/100 Pages) NXP

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Table 8. Electrostatic discharge and latch-up ratings

Parameter description

Rating

Reference

Comment

Electrostatic

Discharge (ESD)

Human Body Model (HBM)

±1000 V

JS-001-2017

—

Charged Device Model (CDM)

±250 V

JS-002-2018

—

Latch-up (LU)

Immunity level:

• Class I@ 25 oC

ambient temperature

• Class II @ 95 oC

ambient temperature

JESD78E

—

4.1.2 Thermal resistance

4.1.2.1 11 x 11 mm FCBGA package thermal characteristics

Table 9 lists the 11 x 11 mm FCBGA package thermal resistance data.

Table 9. 11 x 11 mm FCBGA thermal resistance data 1

Rating

Board Type2

Symbol

Values

Unit

Junction to Ambient Thermal Resistance3

JESD51-9, 2s2p

RθJA

22.2

oC/W

Junction-to-Top of Package

Thermal Characterization parameter3

JESD51-9, 2s2p

ΨJT

0.4

oC/W

Junction to Case Thermal Resistance

N/A

RθJC

8.5

oC/W

1. Power dissipation: Total power 1.24 W

2. Thermal test board meets JEDEC specification for this package (JESD51-9).

3. Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is

solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not

meant to predict the performance of a package in an application-specific environment.

4. Junction-to-Case thermal resistance determined using an isothermal cold plate.

4.1.2.2 9 x 9 mm FCBGA package thermal characteristics

Table 10 lists the 9 x 9 mm FCBGA package thermal resistance data.

Table 10. 9 x 9 mm FCBGA thermal resistance data1

Rating

Board Type2

Symbol

Values

Unit

Junction to Ambient Thermal Resistance3

JESD51-9, 2s2p

RθJA

28.7

oC/W

Junction-to-Top of Package

Thermal Characterization parameter3

JESD51-9, 2s2p

ΨJT

0.7

oC/W

Junction to Case Thermal Resistance4

N/A

RθJC

8.5

oC/W

1. Power dissipation: Total power 1.24 W

NXP Semiconductors

IMX91CEC

i.MX 91 Application Processors Data Sheet for Commercial Products

IMX91CEC

All information provided in this document is subject to legal disclaimers.

Preliminary Data Sheet

Rev. 2 — 12 November 2024

Preliminary - Subject to Change Without Notice

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