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BQ51221 Datasheet(PDF) 46 Page - Texas Instruments |
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BQ51221 Datasheet(HTML) 46 Page - Texas Instruments |
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46 / 50 page ![]() NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PACKAGE OUTLINE 4219071 / A 05/2017 www.ti.com VQFN - 1 mm max height PLASTIC QUAD FLATPACK- NO LEAD RHL0020A A 0.08 C 0.1 C A B 0.05 C B SYMM SYMM PIN 1 INDEX AREA SEATING PLANE C 1 PIN 1 ID (OPTIONAL) 2.05±0.1 3.05±0.1 3.6 3.4 4.6 4.4 1 MAX (0.2) TYP 2X (0.55) 2X 3.5 14X 0.5 2 9 10 11 12 19 20 2X 1.5 4X (0.2) 20X 0.29 0.19 20X 0.5 0.3 21 |
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