BQ51221 datasheet(6/50 Pages) TI2

6 / 50 page

I/O

DESCRIPTION

NAME

YFP

RHL

FOD

Input for the rectified power measurement. See Section 8.3.16 for details.

ILIM

I/O

Programming pin for the over current limit. The total resistance from ILIM to GND (RILIM) sets the

current limit. The schematic shown in Figure 9-1 illustrates the RILIM as R1 + RFOD. Details can be

found in Section 7.5 and Figure 9-1.

OUT

D1, D2,

D3, D4

Output pin, delivers power to the load.

PGND

A1, A2,

A3, A4

1, 20

Power ground

RECT

C2, C3

Filter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND.

Depending on the power levels, the value may be 4.7 μF to 22 μF.

TS/CTRL

Dual function pin: Temperature Sense (TS) and Control (CTRL) pin functionality.

For the TS functionality connect TS/CTRL to ground through a Negative Temperature Coefficient

(NTC) resistor. If an NTC function is not desired, connect to PGND with a 10-kΩ resistor. See Section

8.3.13 for more details.

For the CTRL functionality pull below VCTRL-Low or pull above VCTRL-High to send an End Power

Transfer Packet. See Table 8-4 for more details.

—

PAD

—

The exposed thermal pad should be connected to ground (PGND)

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

Input voltage

AC1, AC2

–0.8

RECT, COMM1, COMM2, OUT, CHG, CLAMP1,

CLAMP2

–0.3

AD, AD-EN

–0.3

BOOT1, BOOT2

–0.3

EN1, EN2, FOD, TS/CTRL, ILIM

–0.3

Input current

AC1, AC2

A(RMS)

Output current

OUT

1.5

Output sink current

CHG

COMM1, COMM2

Junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

All voltages are with respect to the VSS terminal, unless otherwise noted.

(2)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

BQ51013B

SLUSB62D – MARCH 2013 – REVISED SEPTEMBER 2020

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