TMDS171 datasheet(7/63 Pages) TI2

7 / 63 page

TMDS171, TMDS171I

www.ti.com

SLLSEN7E – OCTOBER 2015 – REVISED SEPTEMBER 2017

Product Folder Links: TMDS171

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(1)

These values are based upon a microcontroller driving the control pins. The pull up/down/floating resistor configuration will set control

pins properly which will have a different value than shown due to internal biasing.

(2)

This value is based upon a microcontroller driving the OE pin. A passive reset circuit using an external capacitor and the internal pullup

resistor will set OE pin properly, but may have a different value than shown due to internal biasing.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply Voltage Nominal Value 3.3 V

3.135

3.3

3.465

VDD

Supply Voltage Nominial Value 1.2 V

1.1

1.2

1.27

TSTG

Storage temperature

–65

150

°C

TCASE

Case temperature

92.7

°C

Operating free-air temperature (TMDS171)

°C

Operating free-air temperature (TMDS171I)

–40

°C

MAIN LINK DIFFERENTIAL PINS

VID(PP)

Peak-to-peak input differential voltage

1560

mVpp

VIC

Input Common Mode Voltage

VCC – 0.4

VCC + 0.1

Data rate

0.25

3.4

Gbps

R(VSADJ)

TMDS compliant swing voltage bias resistor 1%

7.06

KΩ

CONTROL PINS

VI(DC)

DC Input Voltage

–0.3

3.6

VIL

(1)

Low-level input voltage OE

0.8

Low-level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL,

SWAP/POL pins only(1)

0.3

VIM

(1)

Mid-Level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL,

SWAP/POL pins only(1)

1.2

1.4

VIH

(1)

High-level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL,

SWAP/POL, OE(2) pins only(1)

2.6

VOL

Low-level output voltage

0.4

VOH

High-level output voltage

2.4

IIH

High level input current

µA

IIL

Low level input current

–25

µA

IOS

Short circuit output current

–50

IOZ

High impedance output current

µA

R(OEPU)

Pull up resistance on OE pin

150

250

KΩ

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

RGZ (QFN)

UNIT

48 PINS

RθJA

Junction-to-ambient thermal resistance

31.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

18.2

RθJB

Junction-to-board thermal resistance

8.1

ψJT

Junction-to-top characterization parameter

0.4

ψJB

Junction-to-board characterization parameter

8.1

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.2

TMDS171 Datasheet(PDF) 7 Page - Texas Instruments

TMDS171 Datasheet(HTML) 7 Page - Texas Instruments

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