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PCF85263ATL/A Datasheet(PDF) 87 Page - NXP Semiconductors |
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PCF85263ATL/A Datasheet(HTML) 87 Page - NXP Semiconductors |
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87 / 102 page ![]() NXP Semiconductors PCF85263A Tiny RTC/Calendar with Alarm Function, Battery Switch-Over, Time Stamp Input, and I2C-bus • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 69 and Table 70 Package reflow temperature (°C) Volume (mm³) Package thickness (mm) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 69. SnPb eutectic process (from J-STD-020D) Package reflow temperature (°C) Volume (mm³) Package thickness (mm) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Table 70. Lead-free process (from J-STD-020D) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 51. 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature MSL: Moisture Sensitivity Level Figure 51. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCF85263A All information provided in this document is subject to legal disclaimers. © 2025 NXP B.V. All rights reserved. Product data sheet Rev. 5.4 — 12 December 2025 Document feedback 87 / 102 |
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