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PCF85263ATL/A Datasheet(PDF) 87 Page - NXP Semiconductors

Part # PCF85263ATL/A
Description  Tiny RTC/Calendar with Alarm Function, Battery Switch-Over, Time Stamp Input, and I2C-bus
PDF  102 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF85263ATL/A Datasheet(HTML) 87 Page - NXP Semiconductors

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NXP Semiconductors
PCF85263A
Tiny RTC/Calendar with Alarm Function, Battery Switch-Over, Time Stamp Input, and I2C-bus
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak
temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to
make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low
enough that the packages and/or boards are not damaged. The peak temperature of the package depends on
package thickness and volume and is classified in accordance with Table 69 and Table 70
Package reflow temperature (°C)
Volume (mm³)
Package thickness (mm)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 69. SnPb eutectic process (from J-STD-020D)
Package reflow temperature (°C)
Volume (mm³)
Package thickness (mm)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Table 70. Lead-free process (from J-STD-020D)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.
Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 51.
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
MSL: Moisture Sensitivity Level
Figure 51. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow
soldering description”.
PCF85263A
All information provided in this document is subject to legal disclaimers.
© 2025 NXP B.V. All rights reserved.
Product data sheet
Rev. 5.4 — 12 December 2025
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