AD2437 datasheet(31/42 Pages) AD

31 / 42 page

AD2437

Rev. 0

Page 31 of 42

July 2023

THERMAL CHARACTERISTICS

The AD2437 A2B transceiver is rated for performance over the

temperature range specified in Operating Conditions.

The JESD51 package thermal characteristics in this section are

provided for package comparison and estimation purposes only.

They are not intended for accurate system temperature calcula-

tion. System thermal simulation is required for accurate

temperature analysis that accounts for all specific 3D system

design features, including, but not limited to other heat sources,

use of heat-sinks, and the system enclosure. Contact Analog

Devices for package thermal models that are intended for use

with thermal simulation tools.

In Table 19, airflow measurements comply with JEDEC stan-

dards JESD51-13, and the junction-to-board measurement

complies with JESD51-8. Test board design complies with

JEDEC standards JESD51-7 for leaded surface mount packages.

The junction-to-case measurement complies with MIL-STD-

883 (Method 1012.1). All measurements use a 2S2P JEDEC test

board.

To estimate the junction temperature of a single device while on

a JEDEC 2S2P PCB, use:

TJ = TCASE + (JT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured at the top center of

the package.



JT is the typical value (junction-to-top of package characteriza-

tion parameter) from Table 19.

PD is the power dissipation.

Values of JA are provided for package comparison and PCB

design considerations. JA can be used for a first-order approxi-

mation of TJ by the equation:

TJ = TA + JA × PD

where TA is the ambient temperature (°C).

Values of JB are provided for package comparison and PCB

design considerations when an external heat sink is required.

The 48-lead LFCSP package requires thermal trace squares and

thermal vias to an embedded ground plane in the PCB. The

exposed paddle must connect to ground for proper operation

and to meet data sheet specifications. Refer to JEDEC standard

JESD51-5 for more information.

Note that the thermal characteristics values provided in

Table 19 are modeled values.

TEST CIRCUITS AND SWITCHING

CHARACTERISTICS

Figure 27 shows a line driver voltage measurement circuit of the

differential line driver and receiver AP/AN and BP/BN pins.

Table 19. Thermal Characteristics

Parameter

Conditions

Typical (°C/W)



Airflow = 0 m/s

23.256



JMA

Airflow = 1 m/s

20.98



JMA

Airflow = 2 m/s

20.19



Airflow = 0 m/s

5.8



Airflow = 0 m/s

0.16



Airflow = 1 m/s

0.28



Airflow = 2 m/s

0.36

Figure 27. Differential Line Driver Voltage Measurement

VOD

AP/BP

AN/BN

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