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ACS8525AP Datasheet(PDF) 107 Page - Semtech Corporation |
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ACS8525AP Datasheet(HTML) 107 Page - Semtech Corporation |
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107 / 112 page  ACS8525A LC/P ADVANCED COMMS & SENSING FINAL DATASHEET Revision 1.00/September 2007 © Semtech Corp. Page 107 www.semtech.com Thermal Conditions The device is rated for full temperature range when this package is used with a 4 layer or more PCB. Copper coverage must exceed 50%. All pins must be soldered to the PCB. Maximum operating temperature must be reduced when the device is used with a PCB with less than these requirements. Figure 17 Typical 64-Pin LQFP Package Landing Pattern Notes: (i) Solderable to this limit. (ii) Square package - dimensions apply in both X and Y directions. (iii) Typical example. The user is responsible for ensuring compatibility with PCB manufacturing process, etc. Pitch 0.5 m ch 0.5 mm Widt idthh 0.3 .3 m mm 1.85 1.85 mm F8525D_029LQFootprt64 |
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