MPC5606S datasheet(129/136 Pages) FREESCALE

129 / 136 page

MPC5606S Microcontroller Data Sheet, Rev. 6

Freescale Semiconductor

129

Ordering information

1 The 176-pin package is available only for chips with 1 MB flash memory.

2 208 MAPBGA available only as development package for Nexus2+, and will not be qualified for production

Figure 54. Commercial product code structure

Qualification status

Power Architecture core

Automotive platform

Core Version

Flash Size (core dependent)

Product

Fab, mask version, mask set indicator

MPC

F0A

Example production code:

Temperature options

Package option

Qualification status

M = General market qualified

P = Engineering samples

S = Automotive qualified

Automotive platform

56 = Power Architecture in 90nm

Core version

0 = e200z0

Flash memory size (z0 core)

2 = 256 KB

4 = 512 KB

6 = 1 MB

Product version

S = Cluster

Fab, mask version, mask set

indicator (only used for SPC part

numbers)

F = ATMC fab

0 = Maskset version (0, 1, etc.)

A = Maskset indicator:

Blank: First production maskset

A: Second production maskset

B: Third production maskset

...

Shipping method

Temperature spec.

C = –40 to 85 °C

V = –40 to 105 °C

Package option

LQ = 144 LQFP

LU = 176 LQFP1

MG = 208 MAPBGA2

Speed

6 = 64 MHz

Shipping method

Blank = Tray

R = Tape and reel

Speed

Example custom-build code:

SC 123456

Custom device prefix

6-digit number

Fields as for production chips (see above)

MPC5606S Datasheet(PDF) 129 Page - Freescale Semiconductor, Inc

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