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AM1802 Datasheet(PDF) 176 Page - Texas Instruments

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Part # AM1802
Description  AM1802 ARM Microprocessor
PDF  180 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

AM1802 Datasheet(HTML) 176 Page - Texas Instruments

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AM1802
SPRS710C – NOVEMBER 2010 – REVISED MARCH 2012
www.ti.com
7.2
Thermal Data for ZWT Package
The following table shows the thermal resistance characteristics for the PBGA-ZWT mechanical package.
Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
ΘJC
Junction-to-case
7.3
N/A
2
R
ΘJB
Junction-to-board
12.4
N /A
3
R
ΘJA
Junction-to-free air
23.7
0.00
4
21.0
0.50
5
20.1
1.00
R
ΘJMA
Junction-to-moving air
6
19.3
2.00
7
18.4
4.00
8
0.2
0.00
9
0.3
0.50
10
PsiJT
Junction-to-package top
0.3
1.00
11
0.4
2.00
12
0.5
4.00
13
12.3
0.00
14
12.2
0.50
15
PsiJB
Junction-to-board
12.1
1.00
16
12.0
2.00
17
11.9
4.00
(1)
These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards - EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2)
m/s = meters per second
7.3
Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
176
Mechanical Packaging and Orderable Information
Copyright © 2010–2012, Texas Instruments Incorporated
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Product Folder Link(s): AM1802



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