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ORLI10G Datasheet(PDF) 67 Page - Agere Systems

Part # ORLI10G
Description  Quad 2.5 Gbits/s 10 Gbits/s, and 12.5 Gbits/s Line Interface FPSC
PDF  72 Pages
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Manufacturer  AGERE [Agere Systems]
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ORLI10G Datasheet(HTML) 67 Page - Agere Systems

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Agere Systems Inc.
67
Data Sheet
October 2001
10 Gbits/s, and 12.5 Gbits/s Line Interface FPSC
ORCA ORLI10G Quad 2.5 Gbits/s
Package Parasitics
The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the
package parasitics. Table 23 lists eight parasitics associated with the ORCA packages. These parasitics represent
the contributions of all components of a package, which include the bond wires, all internal package routing, and
the external leads.
Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual
inductance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and
inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the near-
est neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed
to be grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading
effect of the lead. Resistance values are in m
Ω.
The parasitic values in Table 23 are for the circuit model of bond wire and package lead parasitics. If the mutual
capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be
added to each of the C1 and C2 capacitors.
Table 23. ORCA ORLI10G Package Parasitics
5-3862(C)r2
Figure 26. Package Parasitics
Package Type
LSW
LMW
RW
C1
C2
CM
LSL
LML
416-Pin PBGAM
3.52
0.80
235
0.40
1.0
0.25
1.5—5.0
0.5—1.30
680-Pin PBGAM
3.80
1.30
250
0.50
1.0
0.30
2.8—5.0
0.5—1.50
PAD N
LSW
R W
CIRCUIT
BOARD PAD
C M
C 1
LSW
R W
LSL
LMW
C 2
C 1
LML
C 2
LSL
PAD N + 1



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