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ORLI10G Datasheet(PDF) 67 Page - Agere Systems |
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ORLI10G Datasheet(HTML) 67 Page - Agere Systems |
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67 / 72 page ![]() Agere Systems Inc. 67 Data Sheet October 2001 10 Gbits/s, and 12.5 Gbits/s Line Interface FPSC ORCA ORLI10G Quad 2.5 Gbits/s Package Parasitics The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the package parasitics. Table 23 lists eight parasitics associated with the ORCA packages. These parasitics represent the contributions of all components of a package, which include the bond wires, all internal package routing, and the external leads. Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual inductance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the near- est neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed to be grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading effect of the lead. Resistance values are in m Ω. The parasitic values in Table 23 are for the circuit model of bond wire and package lead parasitics. If the mutual capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be added to each of the C1 and C2 capacitors. Table 23. ORCA ORLI10G Package Parasitics 5-3862(C)r2 Figure 26. Package Parasitics Package Type LSW LMW RW C1 C2 CM LSL LML 416-Pin PBGAM 3.52 0.80 235 0.40 1.0 0.25 1.5—5.0 0.5—1.30 680-Pin PBGAM 3.80 1.30 250 0.50 1.0 0.30 2.8—5.0 0.5—1.50 PAD N LSW R W CIRCUIT BOARD PAD C M C 1 LSW R W LSL LMW C 2 C 1 LML C 2 LSL PAD N + 1 |
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