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BMC150 Datasheet(PDF) 6 Page - List of Unclassifed Manufacturers

Part # BMC150
Description  6-axis eCompass
PDF  141 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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BMC150 Datasheet(HTML) 6 Page - List of Unclassifed Manufacturers

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Datasheet
eCompass BMC150
Page 6
Confidential
BST-BMC150-DS000-03 | Revision 0.4 | February 2013
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice. Not intended for publication.
7.5 INTERRUPT STATUS REGISTER ......................................................................................... 108
7.6 POWER AND OPERATION MODES, SELF-TEST AND DATA OUTPUT RATE CONTROL REGISTERS 109
7.7 INTERRUPT AND AXIS ENABLE SETTINGS CONTROL REGISTERS........................................... 111
7.8 NUMBER OF REPETITIONS CONTROL REGISTERS ............................................................... 113
8. DIGITAL INTERFACES..........................................................................................................115
8.1 SERIAL PERIPHERAL INTERFACE (SPI).............................................................................. 116
8.2 INTER-INTEGRATED CIRCUIT (I²C) .................................................................................... 120
8.2.1 SPI AND I²C ACCESS RESTRICTIONS .......................................................................................... 125
9. PIN-OUT AND CONNECTION DIAGRAM.............................................................................126
9.1 PIN-OUT ......................................................................................................................... 126
9.2 CONNECTION DIAGRAM 4-WIRE SPI ................................................................................. 127
9.3 CONNECTION DIAGRAM 3-WIRE SPI ................................................................................. 128
9.4 CONNECTION DIAGRAM I2C.............................................................................................. 129
10. PACKAGE ............................................................................................................................130
10.1 OUTLINE DIMENSIONS.................................................................................................... 130
10.2 SENSING AXES ORIENTATION ......................................................................................... 131
10.3 ANDROID AXES ORIENTATION......................................................................................... 132
10.4 LANDING PATTERN RECOMMENDATION ........................................................................... 134
10.5 MARKING...................................................................................................................... 135
10.5.1 MASS PRODUCTION DEVICES .................................................................................................... 135
10.5.2 ENGINEERING SAMPLES............................................................................................................ 135
10.6 SOLDERING GUIDELINES................................................................................................ 136
10.7 HANDLING INSTRUCTIONS.............................................................................................. 137
10.8 TAPE AND REEL SPECIFICATION...................................................................................... 138
10.8.1 TAPE AND REEL DIMENSIONS..................................................................................................... 138
10.8.2 ORIENTATION WITHIN THE REEL................................................................................................. 138
10.9 ENVIRONMENTAL SAFETY .............................................................................................. 139
10.9.1 HALOGEN CONTENT ................................................................................................................. 139
10.9.2 INTERNAL PACKAGE STRUCTURE ............................................................................................... 139
11. LEGAL DISCLAIMER...........................................................................................................140
11.1 ENGINEERING SAMPLES................................................................................................. 140
11.2 PRODUCT USE .............................................................................................................. 140
11.3 APPLICATION EXAMPLES AND HINTS ............................................................................... 140
12. DOCUMENT HISTORY AND MODIFICATION ...................................................................141



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