SC16C554 datasheet(52/55 Pages) PHILIPS

52 / 55 page

Philips Semiconductors

SC16C554/554D

Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder

Product data

Rev. 05 — 10 May 2004

52 of 55

9397 750 13132

[3]

These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reﬂow

soldering with peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reﬂow

oven. The package body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or

larger than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than

0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex

foil by using a hot bar soldering process. The appropriate soldering proﬁle can be provided on

request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

SC16C554 Datasheet(PDF) 52 Page - NXP Semiconductors