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AD9681

Data Sheet

Rev. C | Page 12 of 40

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to GND

−0.3 V to +2.0 V

DRVDD to GND

−0.3 V to +2.0 V

Digital Outputs (D0±xx, D1±xx, DCO±1,

DCO±2, FCO±1, FCO±2) to GND

−0.3 V to +2.0 V

CLK+, CLK− to GND

−0.3 V to +2.0 V

VIN±x1, VIN±x2 to GND

−0.3 V to +2.0 V

SCLK/DTP, SDIO/OLM, CSB1, CSB2 to GND

−0.3 V to +2.0 V

SYNC, PDWN to GND

−0.3 V to +2.0 V

RBIAS1, RBIAS2 to GND

−0.3 V to +2.0 V

VREF, VCM1, VCM2, SENSE to GND

−0.3 V to +2.0 V

Environmental

Operating Temperature Range (Ambient)

−40°C to +85°C

Maximum Junction Temperature

150°C

Lead Temperature (Soldering, 10 sec)

300°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

Typical θJA is specified for a 4-layer PCB with a solid ground plane.

Airflow improves heat dissipation, which reduces θJA. In addition,

metal in direct contact with the package leads from metal traces,

through holes, ground, and power planes reduces θJA.

Table 7. Thermal Resistance (Simulated)

Package Type

Airflow

Velocity

(m/sec)

θJA1, 2



1, 2

Unit

144-Ball, 10 mm × 10 mm

CSP-BGA

30.2

0.13

°C/W

1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

ESD CAUTION

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