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ADT7312 Datasheet(PDF) 7 Page - Analog Devices

Part # ADT7312
Description  Digital SPI Temperature Sensor in Die Form
PDF  25 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADT7312 Datasheet(HTML) 7 Page - Analog Devices

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ADT7312
Data Sheet
| Page 6 of 24
PAD CONFIGURATION AND FUNCTION DESCRIPTIONS
1950µm
2350µm
VDD
VDD
GND
GND
CT
INT
DIN
DOUT
SCLK
CS
Figure 3. Metallization Picture
Table 4. Pad Function Descriptions
Pad No.
Pad Name
Description
1
SCLK
Serial Clock Input. The serial clock is used to clock data into and out of any register of the device.
2
DOUT
Serial Data Output. Data is clocked out on the falling edge of SCLK and is valid on the rising edge of SCLK.
3
DIN
Serial Data Input. Data to be loaded into the control registers of the part is provided on this input. Data is clocked
into the registers on the rising edge of SCLK.
4
CS
Chip Select Input. The device is enabled when this pin is low. The device is disabled when this pin is high.
5
INT
Overtemperature and Undertemperature Indicator. Logic output. When the device is powered up, this output is an
active low interrupt by default. Open-drain configuration. A pull-up resistor is required, typically 10 kΩ.
6
CT
Critical Overtemperature Indicator. Logic output. The default power-on polarity is active low. Open-drain
configuration. A pull-up resistor is required, typically 10 kΩ.
7
GND
Analog Ground. This pad must be connected directly to Pad 8 (digital ground).
8
GND
Digital Ground. This pad must be connected directly to Pad 7 (analog ground).
9
VDD
Analog Supply Voltage (2.7 V to 5.5 V). This pad must be connected directly to Pad 10 (digital supply voltage). The
supply should be decoupled with a 0.1 μF ceramic capacitor to GND.
10
VDD
Digital Supply Voltage (2.7 V to 5.5 V). This pad must be connected directly to Pad 9 (analog supply voltage). The
supply should be decoupled with a 0.1 μF ceramic capacitor to GND.
Rev. A



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