TMP117 datasheet(36/45 Pages) TI1

36 / 45 page

TI Device

SCL

SDA

GND

V+

ALERT

ADD0

100 nF

≥

0.5 kΩ

1.9 V to 3.6 V

TMP117

SNOSD82 – JUNE 2018

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9 Power Supply Recommendations

The TMP117 operates on a power-supply range from 1.9 V to 5.5 V. The device is trimmed for operation at a

3.3-V supply, but can measure temperature accurately in the full supply range. A power-supply bypass capacitor

is required, which must be placed as close to the supply and ground pins of the device as possible. A typical

value for this supply bypass capacitor is 100 nF. Applications with noisy or high-impedance power supplies may

require additional decoupling capacitors to reject power-supply noise.

The TMP117 is a very low-power device that generates low noise on the supply bus. The user can apply an RC

filter to the V+ pin of the device to further reduce noise that the TMP117 might propagate to other components.

RF in Figure 41 must be less than 0.5 kΩ and CF must be at least 100 nF. The package thermal pad is not

connected to the device ground and can be left floating for convenience or grounded for better thermal

resistance.

Figure 41. Noise-Reduction Techniques

10 Layout

10.1 Layout Guidelines

NOTE

To achieve a high-precision temperature reading for a rigid PCB, do not solder down the

thermal pad. For a flexible PCB, the user can solder the thermal pad to increase board

level reliability.

For more information on board layout, refer to the related Precise Temperature Measurements With TMP116

(SNOA986) and Wearable Temperature Sensing Layout Considerations Optimized for Thermal Response

(SNIA021) application reports on ti.com.

Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended

value of this bypass capacitor is 0.1 μF. Additional decoupling capacitance can be added to compensate for

noisy or high-impedance power supplies. In some cases, the pullup resistor can be the heat source, therefore,

maintain some distance between the resistor and the device. Mount the TMP117 on the PCB pad to provide the

minimum thermal resistance to the measured object surface or to the surrounding air. The recommended PCB

layout minimizes the device self-heating effect, reduces the time delay as temperature changes, and minimizes

the temperature offset between the device and the object.

TMP117 Datasheet(PDF) 36 Page - Texas Instruments

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