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LTC2662 Datasheet(PDF) 8 Page - Analog Devices

Part # LTC2662
Description  Five-Channel Current-Source- Output 16-Bit SoftSpan DACs
PDF  28 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC2662 Datasheet(HTML) 8 Page - Analog Devices

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LTC2662
8
Rev 0
For more information www.analog.com
TIMING CHARACTERISTICS The
l
denotes the specifications which apply over the full operating junction
temperature range, otherwise specifications are at TJ = 25°C. Digital input low and high voltages are 0V and IOVCC, respectively.
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to GND.
Note 3: Offset current is measured at code 384; Linearity is defined from
code 384 to code 65,535.
Note 4: For IFS = 300mA, RLOAD = 10Ω; IFS = 200mA, RLOAD = 15Ω;
IFS = 100mA, RLOAD = 30Ω; IFS = 50mA, RLOAD = 50Ω; IFS = 25mA,
RLOAD = 100Ω; IFS = 12.5mA, RLOAD = 200Ω; IFS = 6.25mA,
RLOAD = 400Ω; IFS = 3.125mA, RLOAD = 800Ω
Note 5: IFS = 200mA, RLOAD = 15Ω; DC crosstalk is measured with a
100mA to 200mA current step on all 4 aggressor channels. Total Power
Dissipation change is 4 × 50mW = 200mW. Monitor channel is held at 3/4
*IFS or 150mA.
Note 6: DAC-to-DAC crosstalk is the glitch that appears at the output
of one DAC due to a 100mA to 200mA step change in an adjacent DAC
channel. The measured DAC is at mid-scale (100mA). 200mA range,
internal reference, VDDX = 5V, V– = –5V.
Note 7: Temperature coefficient is calculated by first computing the ratio
of the maximum change in output voltage to the nominal output voltage.
The ratio is then divided by the specified temperature range.
Note 8: Guaranteed by design and not production tested.
Note 9: VDDX = 5V (3.125mA range); VDDX = 4V (200mA range); V– = –5V
for all ranges. For large current output steps, internal thermal effects result
in a final settling tail. In most cases the tail is too small to affect settling
to ±0.024%, but several milliseconds may be needed for full settling to the
±0.0015% level. For best results, always solder the exposed pad (pin 33)
to a solid GND plane, and set VDDX as low as practicable for each channel
to reduce power dissipation in the part. The listed results were obtained
using a DC2692 demo circuit with no additional heatsinks.
Note 10: VCC = IOVCC = 5V; VDD0-4 = 5V, V– = –5V.
Note 11: Digital Inputs at 0V or IOVCC.
Note 12: Internal reference mode. Load is 15Ω (200mA range) or 800Ω
(3.125mA range) in parallel with 100pF terminated to GND.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
t9
CLR Pulse Width
l
20
ns
t10
CS/LD High to SCK Positive Edge
l
7
ns
t12
LDAC Pulse Width
l
15
ns
t13
CS/LD High to LDAC High or Low Transition
l
15
ns
SCK Frequency
50% Duty Cycle
l
50
MHz
t14
TGP High Time
(Note 8)
l
1
µs
t15
TGP Low Time
(Note 8)
l
1
µs
V+ = VDDX = VCC = 2.85V to 5.5V, 1.71V ≤ IOVCC < 2.85V
t1
SDI Valid to SCK Setup
l
7
ns
t2
SDI Valid to SCK Hold
l
7
ns
t3
SCK HIGH Time
l
30
ns
t4
SCK LOW Time
l
30
ns
t5
CS/LD Pulse Width
l
15
ns
t6
LSB SCK High to CS/LD High
l
19
ns
t7
CS/LD Low to SCK High
l
7
ns
t8
SDO Propagation Delay From SCK Falling Edge
CLOAD = 10pF
l
60
ns
t9
CLR Pulse Width
l
30
ns
t10
CS/LD High to SCK Positive Edge
l
7
ns
t12
LDAC Pulse Width
l
15
ns
t13
CS/LD High to LDAC High or Low Transition
l
15
ns
SCK Frequency
50% Duty Cycle
l
15
MHz
t14
TGP High Time
(Note 8)
l
1
µs
t15
TGP Low Time
(Note 8)
l
1
µs



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