LTC2662

27

Rev 0

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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

UH Package

32-Lead Plastic QFN (5mm × 5mm)

(Reference LTC DWG # 05-08-1693 Rev D)

5.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE

M0-220 VARIATION WHHD-(X) (TO BE APPROVED)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40

±0.10

31

1

2

32

BOTTOM VIEW—EXPOSED PAD

3.50 REF

(4-SIDES)

3.45

±0.10

3.45

±0.10

0.75

±0.05

R = 0.115

TYP

0.25

±0.05

(UH32) QFN 0406 REV D

0.50 BSC

0.200 REF

0.00 – 0.05

0.70

±0.05

3.50 REF

(4 SIDES)

4.10

±0.05

5.50

±0.05

0.25

±0.05

PACKAGE OUTLINE

0.50 BSC

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

PIN 1 NOTCH R = 0.30 TYP

OR 0.35

× 45° CHAMFER

R = 0.05

TYP

3.45

±0.05

3.45

±0.05

UH Package

32-Lead Plastic QFN (5mm

× 5mm)

(Reference LTC DWG # 05-08-1693 Rev D)