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NCP5331 Datasheet(PDF) 20 Page - ON Semiconductor |
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NCP5331 Datasheet(HTML) 20 Page - ON Semiconductor |
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20 / 38 page ![]() NCP5331 http://onsemi.com 20 During no load conditions the VDRP pin is at the same voltage as the VFB pin, so none of the VFB bias current flows through the VDRP resistor. When output current increases the VDRP pin increases proportionally and the VDRP pin current offsets the VFB bias current and causes the output voltage to decrease. The response during the first few microseconds of a load transient are controlled primarily by power stage output impedance and the ESR and ESL of the output filter. The transition between fast and slow positioning is controlled by the total ramp size and the error amp compensation. If the current signal (external ramp) size is too large or the error amp too slow there will be a long transition to the final voltage after a transient. This will be most apparent with lower capacitance output filters. Error Amp Compensation, Tuning, and Soft Start The transconductance error amplifier requires a capacitance (CC1 + CC2 in the Applications Diagram) between the COMP pin and GND for two reasons. First, this capacitance stabilizes the transconductance error amplifier. Values less than a few nF may cause oscillations of the COMP voltage and increase the output voltage jitter. Second, this capacitance sets the soft start and hiccup mode slopes. The internal error amplifier will source approximately 30 µA during soft start and hiccup mode. No switching will occur until the COMP voltage exceeds the Channel Startup Offset (nominally 0.6 V). If CC2 is set to 0.1 µF the 30 µA from the error amplifier will allow the output to ramp up or down at approximately 30 µ A/0.1 µF or 0.3 V/ms or 1.2 V in 4 ms. The COMP voltage will ramp up to the following value. VCOMP + VCORE @0A ) Channel_Startup_Offset ) Int_Ramp ) GCSA @ Ext_Ramp 2 The COMP pin will disable the converter when pulled below the COMP Discharge Threshold (nominally 0.27 V). The RC network between the COMP pin and the soft start capacitor (RC1, CC1) allows the COMP voltage to slew quickly during transient loading of the converter. Without this network the error amplifier would have to drive the large soft start capacitor (CC2) directly, which would drastically limit the slew rate of the COMP voltage. The RC1/CC1 network allows the COMP voltage to undergo a step change of approximately RC1 ⋅ ICOMP. The capacitor (CA1) between the COMP pin and the error amplifier’s inverting input (the VFB pin) and the parallel combination of the resistors RF1 and RDRP determine the bandwidth of the error amplifier. The gain of the error amplifier crosses 0 dB at a high enough frequency to give a quick transient response, but well below the switching frequency to minimize ripple and noise on the COMP pin. A capacitor in parallel with the RF1 resistor (CF1) adds a zero to boost phase near the crossover frequency to improve loop stability. Figure 26. Power Good Delay Operation NOTE: The PGD timer insures that PGD will transition high when VCORE is in regulation. Setting up and tuning the error amplifier is a three step process. First, the no-load and full-load adaptive voltage positioning (AVP) are set using RF1 and RDRP, respectively. Second, the current sense time constant and error amplifier gain are adjusted with RSx and CA1 while monitoring VCORE during transient loading. Lastly, the peak-to-peak voltage ripple on the COMP pin is examined when the converter is fully loaded to insure low output voltage jitter. The exact details of this process are covered in the Design Procedure section. Undervoltage Lockout (UVLO) The controller has undervoltage lockout comparators monitoring two pins. One, intended for the logic and low- side drivers, is connected to the VCCL pin with an 8.5 V turn-on and 6.15 V turn-off threshold. A second, for the high side drivers, is connected to the VCCH pin with an 8.5 V turn-on and 6.75 V turn-off threshold. A UVLO fault sets the fault latch which forces switching to stop and the upper and lower gate drivers produce a logic low (i.e., all the MOSFETs are turned OFF). Power good (PGD) is pulled low when UVLO occurs. The overcurrent/overvoltage latch is reset by the UVLO signal. Power Good (PGD) Delay Time When VCORE is less than the power good threshold, 87.5% ⋅ DAC, or greater than 2.0 V the open-collector power good pin (PGD) will be pulled low by the NCP5331. When VCORE is in regulation PGD will become high impedance. An external pull-up resistor is required on PGD. During soft start, when VCORE reaches the power good threshold, 87.5% ⋅ DAC, then the “longer” of two timers will dictate when PGD becomes high impedance. One timer is internally set to 200 µs and can not be changed. Placing a capacitor from the CPGD pin to GND sets the second programmable timer. When VCORE crosses the PGD threshold, a current source will charge CPGD starting at |
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