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DS3172 Datasheet(PDF) 1 Page - Dallas Semiconductor

Part # DS3172
Description  Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers
PDF  232 Pages
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Manufacturer  DALLAS [Dallas Semiconductor]
Direct Link  https://www.maximintegrated.com/en.html
Logo DALLAS - Dallas Semiconductor

DS3172 Datasheet(HTML) 1 Page - Dallas Semiconductor

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REV: 102204
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.
GENERAL DESCRIPTION
The DS3171, DS3172, DS3173, and DS3174
(DS317x) combine a DS3/E3 framer(s) and LIU(s) to
interface to as many as four DS3/E3 physical copper
lines.
APPLICATIONS
Access Concentrators
Multiservice Access
Platform (MSAP)
SONET/SDH ADM
and Muxes
PBXs
Multiservice Protocol
Platform (MSPP)
Digital Cross Connect
Test Equipment
PDH Multiplexer/
Demultiplexer
Routers and Switches
Integrated Access Device
(IAD)
ORDERING INFORMATION
PART
TEMP RANGE
PIN-PACKAGE
DS3171*
0°C to +70°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
DS3171N*
-40°C to +85°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
DS3172*
0°C to +70°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
DS3172N*
-40°C to +85°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
DS3173*
0°C to +70°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
DS3173N*
-40°C to +85°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
DS3174
0°C to +70°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
DS3174N
-40°C to +85°C
400 TE-CSBGA (27mm x
27mm, 1.27mm pitch)
*Future product—contact factory for availability.
FUNCTIONAL DIAGRAM
DS317x
DS3/E3
PORTS
DS3/
E3
LIU
DS3/E3
FRAMER/
FORMATTER
SYSTEM
BACKPLANE
FEATURES
§
Single (DS3171), Dual (DS3172), Triple
(DS3173), or Quad (DS3174) Single-Chip
Transceiver for DS3 and E3
§
All Four Devices are Pin Compatible for Ease of
Port Density Migration in the Same Printed
Circuit Board Platform
§
Each Port Independently Configurable
§
Performs Receive Clock/Data Recovery and
Transmit Waveshaping for DS3 and E3
§
Jitter Attenuator can be Placed Either in the
Receive or Transmit Paths
§
Interfaces to 75
W Coaxial Cable at Lengths Up to
380 meters, or 1246 feet (DS3) or 440 meters, or
1443 feet (E3)
§
Uses 1:2 Transformers on Both Tx and Rx
§
On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or
G.832) Framer(s)
§
Ports Independently Configurable for DS3, E3
§
Built-In HDLC Controllers with 256-Byte FIFOs
for the Insertion/Extraction of DS3 PMDL, G.751
Sn Bit, and G.832 NR/GC Bytes
§
On-Chip BERTs for PRBS and Repetitive Pattern
Generation, Detection, and Analysis
§
Large Performance-Monitoring Counters for
Accumulation Intervals of at Least 1 Second
§
Flexible Overhead Insertion/Extraction Ports for
DS3, E3 Framers
DS3171/DS3172/DS3173/DS3174
Single/Dual/Triple/Quad
DS3/E3 Single-Chip Transceivers
www.maxim-ic.com


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