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SC3200 Datasheet(PDF) 121 Page - Advanced Micro Devices

Part # SC3200
Description  AMD GEODE-TM SC3200 PROCESSOR
PDF  447 Pages
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Manufacturer  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

SC3200 Datasheet(HTML) 121 Page - Advanced Micro Devices

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AMD Geode™ SC3200 Processor Data Book
121
SuperI/O Module
Revision 5.1
5.5
Real-Time Clock (RTC)
The RTC provides timekeeping and calendar management
capabilities. The RTC uses a 32.768 KHz signal as the
basic clock for timekeeping. It also includes 242 bytes of
battery-backed RAM for general-purpose use.
The RTC provides the following functions:
• Accurate timekeeping and calendar management
• Alarm at a predetermined time and/or date
• Three programmable interrupt sources
• Valid timekeeping during power-down, by utilizing
external battery backup
• 242 bytes of battery-backed RAM
• RAM lock schemes to protect its content
• Internal oscillator circuit (the crystal itself is off-chip), or
external clock supply for the 32.768 KHz clock
• A century counter
• PnP support:
— Relocatable Index and Data registers
— Module access enable/disable option
— Host interrupt enable/disable option
• Additional low-power features such as:
— Automatic switching from battery to VSB
— Internal power monitoring on the VRT bit
— Oscillator disabling to save battery during storage
• Software compatible with the DS1287 and MC146818
5.5.1
Bus Interface
The RTC function is initially mapped to the default SuperI/O
locations at Indexes 70h to 73h (two Index/Data pairs).
These locations may be reassigned, in compliance with
Plug and Play requirements.
5.5.2
RTC Clock Generation
The RTC uses a 32.768 KHz clock signal as the basic
clock for timekeeping. The 32.768 KHz clock can be sup-
plied by the internal oscillator circuit, or by an external
oscillator (see Section 5.5.2.2 "External Oscillator" on page
122).
5.5.2.1
Internal Oscillator
The internal oscillator employs an external crystal con-
nected to the on-chip amplifier. The on-chip amplifier is
accessible on the X32I input and X32O output. See Figure
5-5 for the recommended external circuit and Table 5-17
for a listing of the circuit components. The oscillator may be
disabled in certain conditions. See Section 5.5.2.8 "Oscilla-
tor Activity" on page 125 for more details.
Figure 5-5. Recommended Oscillator External
Circuitry
VBAT
CF
Internal
External
R2
X32I
X32O
C1
C2
R1
Y
To other
modules
Battery
B1
CF = 0.1 µF
Table 5-17. Crystal Oscillator Circuit Components
Component
Parameters
Values
Tolerance
Crystal
Resonance Frequency
32.768 KHz Parallel mode
User-defined
Type
N-cut or XY-bar
Serial Resistance
40 K
Ω
Max
Quality Factor, Q
35000
Min
Shunt Capacitance
2 pF
Max
Load Capacitance, CL
9-13 pF
Temperature Coefficient
User-defined
Resistor R1
Resistance
20 M
Ω
5%
Resistor R2
Resistance
120 K
Ω
5%
Capacitor C1
Capacitance
3 to 10 pF
5%
Capacitor C2
Capacitance
3 to 10 pF
5%



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