LTC4413 datasheet(30/32 Pages) AD

30 / 32 page

LTC4421

Rev. 0

For more information www.analog.com

PACKAGE DESCRIPTION

5.00

±0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

BOTTOM VIEW—EXPOSED PAD

4.50 REF

6.00

±0.10

R = 0.125

TYP

0.25

±0.05

4.60

±0.10

3.60

±0.10

(UHE36) QFN 0410 REV Ø

0.50 BSC

4.60

±0.05

3.60

±0.05

0.75

±0.05

0.00 – 0.05

0.200 REF

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

3.50 REF

0.40

±0.10

0.70

±0.05

0.50 BSC

4.50 REF

3.50 REF

4.10

±0.05

5.50

±0.05

5.10

±0.05

6.50

±0.05

0.25

±0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP

OR 0.35

× 45°

CHAMFER

R = 0.10

TYP

UHE Package

36-Lead Plastic QFN (5mm

× 6mm)

(Reference LTC DWG # 05-08-1876 Rev Ø)

LTC4413 Datasheet(PDF) 30 Page - Analog Devices

LTC4413 Datasheet(HTML) 30 Page - Analog Devices

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