TLV9022 datasheet(6/67 Pages) TI

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

–0.3

Input pins (IN+, IN–) from V–(2)

–0.3

Current into Input pins (IN+, IN–)

–10

Output (OUT) from V–, open drain

only(3)

–0.3

Output (OUT) from V–, push-pull only

–0.3

(V+) + 0.3

Output short circuit duration(4)

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Input terminals are diode-clamped to (V–). Input signals that can swing more than 0.3 V beyond the supply rails must be current-limited

to 10 mA or less. Additionally, Inputs (IN+, IN–) can be greater than V+ and OUT as long as it is within the –0.3 V to 6 V range

(3)

Output (OUT) for open drain can be greater than V+ and inputs (IN+, IN–) as long as it is within the –0.3 V to 6 V range

(4)

Short-circuit to V– or V+. Short circuits from outputs can cause excessive heating and eventual destruction.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

1.65

5.5

Input voltage range (IN+, IN–) from (V–)

–0.2

5.7

Ambient temperature, TA

–40

125

°C

Thermal Information, TLV90x0,TLV90x1

THERMAL METRIC (1)

TLV90x0,TLV90x1

UNIT

DCK

(SC-70)

DBV

(SOT-23)

5 PINS

RqJA

Junction-to-ambient thermal resistance

238.5

223.7

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

134.0

123.2

°C/W

RqJB

Junction-to-board thermal resistance

87.6

91.4

°C/W

yJT

Junction-to-top characterization parameter

59.1

58.7

°C/W

yJB

Junction-to-board characterization parameter

87.2

91.0

°C/W

RqJC(bot)

Junction-to-case (bottom) thermal resistance

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TLV9020, TLV9021, TLV9022, TLV9024, TLV9030, TLV9031, TLV9032, TLV9034

SNOSDA3F – JUNE 2020 – REVISED MARCH 2023

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Product Folder Links: TLV9020 TLV9021 TLV9022 TLV9024 TLV9030 TLV9031 TLV9032 TLV9034

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