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TLV9022 Datasheet(PDF) 7 Page - Texas Instruments

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Part # TLV9022
Description  TLV902x and TLV903x Precision Comparator Family
PDF  67 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV9022 Datasheet(HTML) 7 Page - Texas Instruments

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6.4 Thermal Information, TLV90x2
THERMAL METRIC (1)
TLV90x2
UNIT
D
(SOIC)
PW
(TSSOP)
DGK
(VSSOP)
DSG
(WSON)
DDF
(SOT-23)
8 PINS
8 PINS
8 PINS
8 PINS
8 PINS
RqJA
Junction-to-ambient thermal resistance
167.7
221.7
215.8
175.2
240.0
°C/W
RqJC(top)
Junction-to-case (top) thermal resistance
107.0
109.1
105.2
178.1
151.0
°C/W
RqJB
Junction-to-board thermal resistance
111.2
152.5
137.5
139.5
157.0
°C/W
yJT
Junction-to-top characterization parameter
53.1
36.4
39.6
47.2
32.8
°C/W
yJB
Junction-to-board characterization parameter
110.4
150.7
135.9
138.9
155.4
°C/W
RqJC(bot)
Junction-to-case (bottom) thermal resistance
–
–
–
127.3
–
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information, TLV90x4
THERMAL METRIC(1)
TLV90x4
UNIT
D (SOIC)
PW
(TSSOP)
RTE
(WQFN)
DYY
(SOT-23)
14 PINS
14 PINS
16 PINS
14 PINS
RqJA
Junction-to-ambient thermal resistance
136.0
155.0
134.1
211.1
°C/W
RqJC(top)
Junction-to-case (top) thermal resistance
91.2
82.0
122.6
121.1
°C/W
RqJB
Junction-to-board thermal resistance
92.0
98.5
109.3
120.4
°C/W
yJT
Junction-to-top characterization parameter
46.9
25.7
30.9
22.3
°C/W
yJB
Junction-to-board characterization parameter
91.6
97.6
108.3
120.1
°C/W
RqJC(bot)
Junction-to-case (bottom) thermal resistance
–
–
98.7
–
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
www.ti.com
TLV9020, TLV9021, TLV9022, TLV9024, TLV9030, TLV9031, TLV9032, TLV9034
SNOSDA3F – JUNE 2020 – REVISED MARCH 2023
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TLV9020 TLV9021 TLV9022 TLV9024 TLV9030 TLV9031 TLV9032 TLV9034



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