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Data Sheet

AD7383-4/AD7384-4

ABSOLUTE MAXIMUM RATINGS

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Table 6. Absolute Maximum Ratings

Parameter

Rating

VCC to GND

−0.3 V to +4 V

VLOGIC to GND

−0.3 V to +4 V

Analog Input Voltage to GND

−0.3 V to VREF + 0.3 V or VCC + 0.3 V

Digital Input Voltage to GND

−0.3 V to VLOGIC + 0.3 V

Digital Output Voltage to GND

−0.3 V to VLOGIC + 0.3 V

REFIO Input to GND

−0.3 V to VCC + 0.3 V

Input Current to Any Pin Except

Supplies

±10 mA

Temperature

Operating Range

−40°C to +125°C

Storage Range

−65°C to +150°C

Maximum Junction

150°C

Pb-Free Soldering Reflow

260°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. θJC is the junction

to case thermal resistance.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-24-251

48.4

0.431

°C/W

1 Test Condition 1: Thermal impedance simulated values are based on JE-

DEC 2S2P thermal test board with four thermal vias. See JEDEC JESDS1.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charge device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for AD7383-4 and AD7384-4

Table 8. AD7383-4 and AD7384-4, 24-lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

±4000

FICDM

±1250

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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