ZL40294 datasheet(35/46 Pages) MICROCHIP

Part #	ZL40294

Description	20-Output DB2000QL Buffer with Ultra-Low Additive Jitter

PDF	46 Pages

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Manufacturer	MICROCHIP [Microchip Technology]

Direct Link	http://www.microchip.com

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35 / 46 page

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2023 Microchip Technology Inc.

DS20006768B-page 35

ZL40294

TABLE 5-11: 6 MM × 6 MM GQFN PACKAGE THERMAL PROPERTIES

Parameter

Symbol

Conditions

Value

Units

Maximum Ambient Temperature

—

°C

Maximum Junction Temperature

TJ(MAX)

—

125

°C

Junction to Ambient Thermal Resis-

tance (Note 1)

θJA

Still air

32.42

°C/W

1 m/s airflow

27.67

2.5 m/s airflow

26.33

Junction to Board Thermal Resistance

θJB

—

12.48

°C/W

Junction to Case Thermal Resistance

θJC

—

21.33

°C/W

Junction to Pad Thermal Resistance

(Note 2)

θJT

Still air

1.83

°C/W

Junction to Top-Center Thermal Char-

acterization Parameter

ψJT

Still air

0.25

°C/W

Note 1: Theta-JA (θJA) is the thermal resistance from junction to ambient when the package is mounted on a 4-

layer JEDEC standard test board and dissipating maximum power

2: Theta-JP (θJP) is the thermal resistance from junction to the center exposed pad on the bottom of the

package)

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