ATMEGA640 datasheet(4/449 Pages) ATMEL

4 / 449 page

ATmega640/1280/1281/2560/2561

2549K–AVR–01/07

Figure 3. Pinout ATmega1281/2561

Note:

The large center pad underneath the QFN/MLF package is made of metal and internally

connected to GND. It should be soldered or glued to the board to ensure good mechani-

cal stability. If the center pad is left unconnected, the package might loosen from the

board.

Disclaimer

Typical values contained in this datasheet are based on simulations and characteriza-

tion of other AVR microcontrollers manufactured on the same process technology. Min.

and Max values will be available after the device is characterized.

ATmega1281/2561

(RXD0/PCINT8/PDI) PE0

(TXD0/PDO) PE1

(XCK0/AIN0) PE2

(OC3A/AIN1) PE3

(OC3B/INT4) PE4

(OC3C/INT5) PE5

(T3/INT6) PE6

(ICP3/CLKO/INT7) PE7

(SS/PCINT0) PB0

(OC0B) PG5

(SCK/ PCINT1) PB1

(MOSI/ PCINT2) PB2

(MISO/ PCINT3) PB3

(OC2A/ PCINT4) PB4

(OC1A/PCINT5) PB5

(OC1B/PCINT6) PB6

PA3 (AD3)

PA4 (AD4)

PA5 (AD5)

PA6 (AD6)

PA7 (AD7)

PG2 (ALE)

PC7 (A15)

PC6 (A14)

PC5 (A13)

PC4 (A12)

PC3 (A11)

PC2 (A10)

PC1 (A9)

PC0 (A8)

PG1 (RD)

PG0 (WR)

INDEX CORNER

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