| Electronic Components Datasheet Search |
|
PCF8820 Datasheet(PDF) 52 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
PCF8820 Datasheet(HTML) 52 Page - NXP Semiconductors |
|
52 / 60 page ![]() 2000 Dec 07 52 Philips Semiconductors Product specification 67 × 101 Grey-scale/ECB colour dot matrix LCD driver PCF8820 Note 1. All x/y coordinates represent the position of the centre of each pad (in µm) with respect to the centre (x/y = 0) of the chip (see Fig.32). Table 11 Bonding pad dimensions dummy 234 −5548.7 +1162.5 dummy 235 −5618.7 +1162.5 Alignment marks Circle 1 −5594.0 −1162.5 Circle 2 +5594.0 −1162.5 Circle 3 +5469.0 +1162.5 Circle 4 −5369.0 +1162.5 SYMBOL PAD COORDINATES(1) xy NAME DIMENSION Pad pitch 70 µm (minimum value) Pad size, aluminium 62 × 100 µm Passivation opening at pad 36 × 76 µm Bump dimensions 52 × 90 × 17.5 µm Wafer thickness (excluding bumps) 381 µm |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |