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RT600 Datasheet(PDF) 168 Page - NXP Semiconductors

Part # RT600
Description  Dual-core microcontroller with 32-bit Cortex®-M33 and Xtensa HiFi4 Audio DSP CPUs; Up to 4.5 MB SRAM; FlexSPI with cache and dynamic decryption; High-speed USB device/host Phy; 12-bit 1 Msamples/s ADC; Analog Comparator; Audio
PDF  171 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

RT600 Datasheet(HTML) 168 Page - NXP Semiconductors

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RT600
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors B.V. 2024. All rights reserved.
Product data sheet
Rev. 2.2 — 25 January 2024
168 of 173
NXP Semiconductors
RT600
Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4
Audio DSP CPUs
10.20.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
10.20.2 Temperature sensor . . . . . . . . . . . . . . . . . . . . 87
10.20.3 Analog Comparator . . . . . . . . . . . . . . . . . . . . 87
10.21
Security features. . . . . . . . . . . . . . . . . . . . . . . 87
10.21.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
10.21.2 AES256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
10.21.3 SHA-1 and SHA-2 . . . . . . . . . . . . . . . . . . . . . 88
10.21.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
10.21.4 PUF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
10.21.4.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
10.21.5 CASPER co-processor . . . . . . . . . . . . . . . . . . 88
10.21.6 Random Number Generator (RNG) . . . . . . . . 88
10.21.7 On-the-Fly Decryption on Octal/Quad SPI
interface (OTFAD) . . . . . . . . . . . . . . . . . . . . . 88
10.21.8 Universally Unique Identifier (UUID). . . . . . . . 89
10.21.9 Device Identifier Composition Engine (DICE). 89
10.22
Emulation and debugging. . . . . . . . . . . . . . . . 89
11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 90
12
Thermal characteristics . . . . . . . . . . . . . . . . . 92
13
Static characteristics. . . . . . . . . . . . . . . . . . . . 93
13.1
General operating conditions . . . . . . . . . . . . . 93
13.2
Power Sequencing . . . . . . . . . . . . . . . . . . . . . 97
13.3
CoreMark data . . . . . . . . . . . . . . . . . . . . . . . . 99
13.4
Power consumption . . . . . . . . . . . . . . . . . . . . 99
13.5
Pin characteristics . . . . . . . . . . . . . . . . . . . . 105
14
Dynamic characteristics . . . . . . . . . . . . . . . . 108
14.1
Wake-up process . . . . . . . . . . . . . . . . . . . . . 108
14.2
IRC (48 MHz/60 MHz and 16 MHz) . . . . . . . 108
14.3
Internal Low Power Oscillator (1 MHz) . . . . . 109
14.4
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 109
14.5
RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 110
14.6
External Clock Input (CLKIN pin, MCLK pin) 110
14.7
Main/System and Audio PLLs. . . . . . . . . . . . 110
14.8
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
14.9
I2S-bus interface. . . . . . . . . . . . . . . . . . . . . . 113
14.10
USART interface. . . . . . . . . . . . . . . . . . . . . . 115
14.11
SPI interfaces (Flexcomm Interfaces 0-7) . . 116
14.12
High Speed SPI Interface (Flexcomm Interface
14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
14.13
FlexSPI flash interface . . . . . . . . . . . . . . . . . 122
14.14
SD/MMC and SDIO . . . . . . . . . . . . . . . . . . . 128
14.15
DMIC subsystem . . . . . . . . . . . . . . . . . . . . . 130
14.16
SCTimer/PWM output timing . . . . . . . . . . . . 130
14.17
MIPI I3C interface . . . . . . . . . . . . . . . . . . . . . 131
14.17
MIPI I3C interface . . . . . . . . . . . . . . . . . . . . . 131
15
Analog characteristics . . . . . . . . . . . . . . . . . 133
15.1
12-bit ADC characteristics . . . . . . . . . . . . . . 133
15.1.1
ADC input impedance. . . . . . . . . . . . . . . . . . 135
15.2
Temperature sensor . . . . . . . . . . . . . . . . . . . 135
15.2.1
Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . 137
16
Application information. . . . . . . . . . . . . . . . . 138
16.1
Current consumption vs Memory Partitions . 138
16.2
Standard I/O pin configuration . . . . . . . . . . . 139
16.3
I/O power consumption. . . . . . . . . . . . . . . . . 139
16.4
RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 141
16.4.1
RTC Printed Circuit Board (PCB) design
guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
16.5
XTAL oscillator . . . . . . . . . . . . . . . . . . . . . . . 144
16.5.1
XTAL Printed Circuit Board (PCB) design
guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . 145
16.6
Suggested USB interface solutions . . . . . . . 145
16.7
Boundary Scan Mode . . . . . . . . . . . . . . . . . 146
16.8
VDDA_BIAS Power Supply Connection . . . 147
17
Package outline. . . . . . . . . . . . . . . . . . . . . . . 148
18
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . 162
20
References. . . . . . . . . . . . . . . . . . . . . . . . . . . 162
21
Revision history . . . . . . . . . . . . . . . . . . . . . . 163
22
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168



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