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RT600 Datasheet(PDF) 168 Page - NXP Semiconductors |
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RT600 Datasheet(HTML) 168 Page - NXP Semiconductors |
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168 / 171 page ![]() RT600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors B.V. 2024. All rights reserved. Product data sheet Rev. 2.2 — 25 January 2024 168 of 173 NXP Semiconductors RT600 Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4 Audio DSP CPUs 10.20.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 10.20.2 Temperature sensor . . . . . . . . . . . . . . . . . . . . 87 10.20.3 Analog Comparator . . . . . . . . . . . . . . . . . . . . 87 10.21 Security features. . . . . . . . . . . . . . . . . . . . . . . 87 10.21.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 10.21.2 AES256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 10.21.3 SHA-1 and SHA-2 . . . . . . . . . . . . . . . . . . . . . 88 10.21.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 10.21.4 PUF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 10.21.4.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 10.21.5 CASPER co-processor . . . . . . . . . . . . . . . . . . 88 10.21.6 Random Number Generator (RNG) . . . . . . . . 88 10.21.7 On-the-Fly Decryption on Octal/Quad SPI interface (OTFAD) . . . . . . . . . . . . . . . . . . . . . 88 10.21.8 Universally Unique Identifier (UUID). . . . . . . . 89 10.21.9 Device Identifier Composition Engine (DICE). 89 10.22 Emulation and debugging. . . . . . . . . . . . . . . . 89 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 90 12 Thermal characteristics . . . . . . . . . . . . . . . . . 92 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 93 13.1 General operating conditions . . . . . . . . . . . . . 93 13.2 Power Sequencing . . . . . . . . . . . . . . . . . . . . . 97 13.3 CoreMark data . . . . . . . . . . . . . . . . . . . . . . . . 99 13.4 Power consumption . . . . . . . . . . . . . . . . . . . . 99 13.5 Pin characteristics . . . . . . . . . . . . . . . . . . . . 105 14 Dynamic characteristics . . . . . . . . . . . . . . . . 108 14.1 Wake-up process . . . . . . . . . . . . . . . . . . . . . 108 14.2 IRC (48 MHz/60 MHz and 16 MHz) . . . . . . . 108 14.3 Internal Low Power Oscillator (1 MHz) . . . . . 109 14.4 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 109 14.5 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 110 14.6 External Clock Input (CLKIN pin, MCLK pin) 110 14.7 Main/System and Audio PLLs. . . . . . . . . . . . 110 14.8 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 14.9 I2S-bus interface. . . . . . . . . . . . . . . . . . . . . . 113 14.10 USART interface. . . . . . . . . . . . . . . . . . . . . . 115 14.11 SPI interfaces (Flexcomm Interfaces 0-7) . . 116 14.12 High Speed SPI Interface (Flexcomm Interface 14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 14.13 FlexSPI flash interface . . . . . . . . . . . . . . . . . 122 14.14 SD/MMC and SDIO . . . . . . . . . . . . . . . . . . . 128 14.15 DMIC subsystem . . . . . . . . . . . . . . . . . . . . . 130 14.16 SCTimer/PWM output timing . . . . . . . . . . . . 130 14.17 MIPI I3C interface . . . . . . . . . . . . . . . . . . . . . 131 14.17 MIPI I3C interface . . . . . . . . . . . . . . . . . . . . . 131 15 Analog characteristics . . . . . . . . . . . . . . . . . 133 15.1 12-bit ADC characteristics . . . . . . . . . . . . . . 133 15.1.1 ADC input impedance. . . . . . . . . . . . . . . . . . 135 15.2 Temperature sensor . . . . . . . . . . . . . . . . . . . 135 15.2.1 Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . 137 16 Application information. . . . . . . . . . . . . . . . . 138 16.1 Current consumption vs Memory Partitions . 138 16.2 Standard I/O pin configuration . . . . . . . . . . . 139 16.3 I/O power consumption. . . . . . . . . . . . . . . . . 139 16.4 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 141 16.4.1 RTC Printed Circuit Board (PCB) design guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 16.5 XTAL oscillator . . . . . . . . . . . . . . . . . . . . . . . 144 16.5.1 XTAL Printed Circuit Board (PCB) design guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . 145 16.6 Suggested USB interface solutions . . . . . . . 145 16.7 Boundary Scan Mode . . . . . . . . . . . . . . . . . 146 16.8 VDDA_BIAS Power Supply Connection . . . 147 17 Package outline. . . . . . . . . . . . . . . . . . . . . . . 148 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . 162 20 References. . . . . . . . . . . . . . . . . . . . . . . . . . . 162 21 Revision history . . . . . . . . . . . . . . . . . . . . . . 163 22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 |
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