LM5145 datasheet(63/73 Pages) TI2

63 / 73 page

9.2.1.2 Thermal Design Resources

• White paper:

– Texas Instruments, Improving Thermal Performance in High Ambient Temperature Environments With

Thermally Enhanced Packaging

• Applications notes:

– Texas Instruments, Thermal Design by Insight, Not Hindsight

– Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages

– Texas Instruments, Semiconductor and IC Package Thermal Metrics

– Texas Instruments, PowerPAD™ Thermally Enhanced Package

– Texas Instruments, Using New Thermal Metrics

• Application brief:

– Texas Instruments, PowerPAD™ Made Easy

9.2.1.3 PCB Layout Resources

• LM5137F-Q1-EVM12V and LM25137F-Q1-EVM5D3 Altium layout source files

• Applications notes:

– Texas Instruments, AN-1149 Layout Guidelines for Switching Power Supplies

• Application brief:

– Texas Instruments, Improve High-Current DC/DC Regulator EMI Performance for Free With Optimized

Power Stage Layout

• Seminar:

– Texas Instruments, Constructing Your Power Supply – Layout Considerations

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.

WEBENCH® is a registered trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

www.ti.com

LM25137

SNVSCU4 – OCTOBER 2025

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LM5145 Datasheet(PDF) 63 Page - Texas Instruments

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