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TPSM84A21

SLVSDF7A – DECEMBER 2016 – REVISED JULY 2017

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the

internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area

(SOA) curves, ensures that the maximum junction temperature of any component inside the module is never exceeded.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

VIN

–0.3

15

V

EN/UVLO

–0.3

7

V

PGOOD, SYNC, VG

–0.3

6

V

ILIM, VADJ, VS+

–0.3

3

V

PGND

–0.3

0.3

V

Output voltage

VOUT

–0.3

3

V

Source current

EN/UVLO

100

µA

Sink current

VG

100

mA

PGOOD

4

mA

Mechanical shock

Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted

500

G

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000Hz

20

G

Operating IC junction temperature, TJ

(2)

–40

125

°C

Operating ambient temperature, TA

(2)

–40

85

°C

Storage temperature, Tstg

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

(1)

The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the

internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area

(SOA) curves, ensures that the maximum junction temperature of any component inside the module is never exceeded.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

8

14

V

VOUT

Output voltage

0.55

1.35

V

VVG

Gate drive voltage

5.0

5.5

V

VEN

EN voltage

0

5.5

V

VPGOOD

PGOOD pull-up voltage

0

5.5

V

VSYNC

SYNC voltage

0

5.5

V

IOUT

Output current

0

10

A

TJ

Operating IC junction temperature (1)

–40

125

°C

TA

Operating ambient temperature (1)

–40

85

°C