AD5710R datasheet(34/56 Pages) AD

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Data Sheet

AD5710R

APPLICATIONS INFORMATION

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Rev. 0 | 34 of 56

POWER SUPPLY RECOMMENDATIONS

The AD5710R does not have any restrictions for power supply

sequencing. The outputs are maintained at POR state with a known

pull-down resistance until proper register configurations are set.

The application module is very limited in terms of space, therefore

it is necessary to reduce both the number of external components

and their size without compromising functional or specification

requirements. Typically, capacitor values are considered with a ±5%

tolerance unless otherwise specified.

Table 13. External Passive Components

Pin Name

Passive Components Required

AVDD

0.1µF || 10µF capacitor per pin to

AGND

PVDDx

0.1µF || 10µF capacitor per pin to

AGND

IOVDD

0.1µF capacitor to AGND

MICROPROCESSOR INTERFACING

Microprocessor interfacing to the AD5710R is via a serial bus that

uses a standard protocol compatible with DSPs and microcontrol-

lers. The communication channel requires a 4‑wire serial interface

consisting of a clock signal (SCLK), a data input signal (MISO), a

data output signal (MOSI), and a synchronization signal (SS).

The SPI interface of the AD5710R is designed for easy connection

to industry-standard DSPs and microcontrollers. Figure 73 shows

the AD5710R connected to the ADuCM320. The ADuCM320 has

an integrated SPI port that can be connected directly to the SPI

pins of the AD5710R.

Figure 73. ADuCM320 SPI Interface

LAYOUT GUIDELINES AND ASSEMBLY

GUIDELINES

The PCB level reliability of the device is directly linked to the PCB

type and design used. Using a PCB material that matches the

coefficient of thermal expansion (CTE) of the silicon (for example,

ceramic) provides the optimal mechanical performance. For organic

material PCBs (for example, FR4) where the CTE is different from

that of the silicon, the use of underfill can increase the mechanical

performance. For organic PCB thickness >0.8mm, consider using

underfill. Particular attention must be given to the underfill material

selection to match the material properties with the application use

conditions.

Consider using low alpha material in the system assembly to

reduce the soft error rate (SER).

The AN-617 Application Note provides information on PCB layout

and assembly for the WLCSP.

THERMAL CONSIDERATIONS

The device has an absolute maximum junction temperature of

150°C and a maximum operating junction temperature (TJ_MAX) of

125°C (see the Absolute Maximum Ratings section). To meet the

specified performance, the AD5710R must be operated at a junc-

tion temperature no greater than 125°C. The junction temperature

is directly affected by the power dissipated across the AD5710R

and the ambient temperature.

Most of the power dissipation of the AD5710R comes from the

IOUT channels. The DC Specifications section specifies the output

current ranges for each IOUT channel and the maximum power

supply voltages. It is important to understand the effects of power

dissipation on the package and the effects the package has on the

junction temperature. The part is packaged in a 25-ball, 2.143mm

× 2.193mm × 0.500mm WLCSP. The thermal resistance values are

specified in Table 6. Table 14 provides examples of the maximum

allowed power dissipation, the maximum allowed ambient tempera-

ture, and the maximum board temperature under certain specified

conditions.

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