AD9122 datasheet(7/56 Pages) AD

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AD9122

Rev. 0 | Page 7 of 56

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 6.

Parameter

With

Respect To

Rating

AVDD33

AVSS, EPAD,

CVSS, DVSS

−0.3 V to +3.6 V

IOVDD

AVSS, EPAD,

CVSS, DVSS

−0.3 V to +3.3 V

DVDD18, CVDD18

AVSS, EPAD,

CVSS, DVSS

−0.3 V to +2.1 V

AVSS

EPAD, CVSS,

DVSS

−0.3 V to +0.3 V

EPAD

AVSS, CVSS,

DVSS

−0.3 V to +0.3 V

CVSS

AVSS, EPAD,

DVSS

−0.3 V to +0.3 V

DVSS

AVSS, EPAD,

CVSS

−0.3 V to +0.3 V

FSADJ, REFIO,

IOUT1P/IOUT1N,

IOUT2P/IOUT2N

AVSS

−0.3 V to AVDD33 + 0.3 V

D[15:0]P/D[15:0]N,

FRAMEP/FRAMEN,

DCIP/DCIN

EPAD, DVSS

−0.3 V to DVDD18 + 0.3 V

DACCLKP/DACCLKN,

REFCLKP/REFCLKN

DVSS

−0.3 V to CVDD18 + 0.3 V

RESET, IRQ, CS, SCLK,

SDIO, SDO

EPAD, DVSS

−0.3 V to IOVDD + 0.3 V

Junction Temperature

125°C

Storage Temperature

Range

−65°C to +150°C

The exposed paddle (EPAD) must be soldered to the ground

plane for the 72-lead, LFCSP. The EPAD performs as an

electrical and thermal connection to the board.

Typical θJA, θJB, and θJC are specified for a 4-layer board in still air.

Airflow increases heat dissipation effectively reducing θJA and θJB.

Table 7. Thermal Resistance

Package

θJA

θJB

θJC

Unit

Conditions

72-Lead LFCSP_VQ

20.7

10.9

1.1

°C/W

EPAD soldered

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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