3000 datasheet(94/102 Pages) INTEL

94 / 102 page

Boxed Processor Specifications

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

7.1

Mechanical Specifications

7.1.1

Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed processor. The

boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a

mechanical representation of the boxed processor.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper

cooling. The physical space requirements and dimensions for the boxed processor with

assembled fan heatsink are shown in Figure 7-2 (Side View), and Figure 7-3 (Top

View). The airspace requirements for the boxed processor fan heatsink must also be

incorporated into new baseboard and system designs. Airspace requirements are

shown in Figure 7-7 and Figure 7-8. Note that some figures have centerlines shown

(marked with alphabetic designations) to clarify relative dimensioning.

Notes:

Diagram does not show the attached hardware for the clip design and is provided only as a mechanical

representation.

Figure 7-2. Space Requirements for the Boxed Processor (Side View)

Figure 7-3. Space Requirements for the Boxed Processor (Top View)

95.0

[3.74]

10.0

[0.39]

25.0

[0.98]

81.3

[3.2]

3000 Datasheet(PDF) 94 Page - Intel Corporation