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Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Package Mechanical Specifications

Package Mechanical

Specifications

The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that

interfaces with the motherboard via an LGA775 socket. The package consists of a

processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)

is attached to the package substrate and core and serves as the mating surface for

processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch

of the processor package components and how they are assembled together. Refer to

the LGA775 Socket Mechanical Design Guide for complete details on the LGA775

socket.

The package components shown in Figure 3-1 include the following:

• Integrated Heat Spreader (IHS)

• Thermal Interface Material (TIM)

• Processor core (die)

• Package substrate

• Capacitors

Note:

Socket and System Board are included for reference and are not part of processor package.

Figure 3-1. Processor Package Assembly Sketch

System Board

LGA775 Socket

Capacitors

TIM

Core (die)

IHS

Substrate

3000 Datasheet(PDF) 33 Page - Intel Corporation