N270 datasheet(3/57 Pages) INTEL

3 / 57 page

Datasheet

Contents

Introduction .....................................................................................................6

1.1

Major Features.......................................................................................6

1.2

Terminology ..........................................................................................7

1.3

References ............................................................................................9

Low Power Features ........................................................................................10

2.1

Clock Control and Low-power States .......................................................10

2.1.1

Thread Low-power State Descriptions.........................................12

2.1.2

Package Low-power State Descriptions .......................................13

2.2

Dynamic Cache Sizing...........................................................................16

2.3

Enhanced Intel SpeedStep® Technology...................................................17

2.4

Enhanced Low-Power States ..................................................................18

2.5

FSB Low Power Enhancements ...............................................................19

2.5.1

Front Side Bus ........................................................................19

Electrical Specifications....................................................................................20

3.1

Power and Ground Pins .........................................................................20

3.2

FSB Clock (BCLK [1:0]) and Processor Clocking ........................................20

3.3

Voltage Identification ............................................................................20

3.4

Catastrophic Thermal Protection .............................................................23

3.5

Reserved and Unused Pins .....................................................................23

3.6

FSB Frequency Select Signals (BSEL [2:0]) ..............................................23

3.7

FSB Signal Groups................................................................................24

3.8

CMOS Asynchronous Signals ..................................................................25

3.9

Maximum Ratings.................................................................................25

3.10

Processor DC Specifications ...................................................................26

Package Mechanical Specifications and Pin Information.........................................33

4.1

Package Mechanical Specifications ..........................................................33

4.1.1

Package Mechanical Drawings ...................................................34

4.2

Processor Pin-out Assignment ................................................................34

4.3

Signal Description ................................................................................41

Thermal Specifications and Design Considerations ...............................................50

5.1

Thermal Diode .....................................................................................51

5.2

Intel® Thermal Monitor.........................................................................53

5.3

Digital Thermal Sensor..........................................................................55

5.3.1

Out of Specification Detection ...................................................56

5.3.2

PROCHOT# Signal Pin ..............................................................56

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